There’s still some time to have input on the MEMS programs at this summer’s SEMICON West! SEMICON West is July 12-14 this year, in San Francisco as always. Deadline for abstracts for presentations is March 15.
The main Tuesday morning MEMS TechXpot session will focus on issues of industry structure and enabling new device technologies. Global Foundries will be giving its take on what CMOS learnings bring to volume MEMS production, Yole Développement will be speaking on trends in industry structural and manufacturing technology, Sand9 will present on CSP technology extending MEMS oscillator performance to wireless applications, and we have even more exciting news to announce soon!
Target speakers for the remaining speaking slots include specialty MEMS foundries on their solutions for faster time to market and ramping volumes for consumer markets, and device makers with innovative integration technology solutions that enable new device capabilities.
The packaging TechXpot session on 3D heterogeneous integration Wednesday afternoon also has opportunities for the MEMS supply chain to talk about their widely applicable packaging technology for stacking different kinds of chips. Organizers are planning a panel on supply chain collaboration, and are recruiting speakers from all parts of the value chain.