One-stop-fusion-shopping at

Guest post by Mike Stanley, Systems Engineer at Freescale

Back in February, I wrote an article describing the Xtrinsic sensor fusion library for Kinetis MCUs. Over the intervening months, we’ve made a number of improvements:

  • Demo and Development versions of the kit have been consolidated into a single installer that covers all options.
  • The limited “Evaluation” version has been removed. In its place, we offer free board-locked licenses tied to your Freedom development board. Licenses are generated automatically during the installation procedure.  You now have access to the full development version with your first download.
  • We’ve added support for two new base boards, bringing the total to four: FRDM-KL25ZFRDM-KL26ZFRDM-K20D50M and FRDM-K64F.
  • We’ve updated the Xtrinsic Sensor Fusion Toolbox for Android to support the new boards.  We also added several neat new features I’ll mention below.
  • We’ve published our Xtrinsic Sensor Fusion Toolbox for Windows.  It’s not a clone of the Android variant, although there are some common features.  It goes will beyond that tool, offering a deeper understanding into some of the underlying calibration and fusion routines.
  • We’ve reworked the Android app landing page into a one-stop-shop for all things related to sensor fusion.  Visit to find convenient links for everything you’ll need to get your project started.  That includes all of the above, plus training materials, and a link to the Freescale Software Services group.  They can provide quotes for production software licenses and custom consulting work.

Figure 1 will look familiar to readers who have experimented with the Xtrinsic Sensor Fusion Toolbox for Android. The rotating PCB display shown here was inspired by that app.  The Windows version gives you some really nice additions.  First and foremost are support (via UART/USB wired connections) for the FRDM-FXS-9AXIS and FRDM-FXS-MULTI sensor boards.  Unlike the FRDM-FXS-MULTI-B board, these do not have Bluetooth modules, and cannot be used with the Android version of the toolbox.  That’s no problem for the Windows variant, which uses the virtual serial port feature of the OpenSDA interface to talk with the boards.  Simply plug your boards into your Windows machine, start the application and click the “Auto Detect” button you see in the upper right of the figure.  The application will cycle through your PCs serial ports until it finds one connected to a Freedom board and running the template app from the Xtrinsic Sensor Fusion Library for Kinetis MCUs.  And if you have a Bluetooth enabled PC, pair it to your FRDM-FXS-MULTI-B and run wirelessly.  The communications interface is the same from the perspective of the Windows GUI.


Figure 1: Xtrinsic Sensor Fusion Toolbox for Windows – Device View

Just like the Android version, you can select from a variety of fusion algorithms.  Also shown are the version of embedded firmware running on your Freedom board, along with the type of board (assuming you have debug packets enabled on the board).



Figure 2: Xtrinsic Sensor Fusion Toolbox for Windows – Sensors View

Figure 2 shows you the “Sensors” view of the application.  Here you have current values and value versus time plots for raw accelerometer and gyro readings, plus calibrated magnetometer.


Figure 3: Xtrinsic Sensor Fusion Toolbox for Windows – Dynamics View

The “Dynamics” view, shown in Figure 4, lets you look at some of the virtual sensor outputs from the sensor fusion library.  These include orientation in roll/pitch/compass heading form, angular velocity and acceleration.  You might wonder what the difference is between “angular velocity” and the gyro readings on the “Sensors” page.  If your algorithm selection supports a physical gyro, then the values in Figure 3 have had gyro offsets subtracted from them.  If your algorithm does not include gyro support, then the angular velocity included here is the result of a “virtual gyro calculation” (see “Building a virtual gyro“).

The accelerometer reading on the “Sensors” page included the effects of both gravity and linear acceleration.  The “Acceleration” item on the “Dynamics” page has had the effects of gravity removed, so it represents only the linear acceleration of your board.



Figure 4: Xtrinsic Sensor Fusion Toolbox for Windows – Magnetics View

I think Figure 4 shows the neatest feature introduced in the toolbox.  Those of you who have seen prior generations of Freescale magnetometer demos will recognize computed hard and soft iron correction coefficients on the left, along with our “magnetic calibration meter”.  What’s new is the 3D-to-2D projection shown on the right.  These are the measured data points selected by the magnetic calibration library for use in determining the correction coefficients.  Ideally, the figure should be circular in shape, be centered at 0,0 and have a radius equal to the magnitude of the earth magnetic field.  Nearby magnets, fixed spatially relative to the sensor, will shift the center to some non-zero value.  Ferrous materials, fixed spatially relative to the sensor, will distort the circle into an ellipsoid, and possibly rotate it.   If sources of interference are not fixed relative to the sensor, you’ll still see distortion, but it will not behave in as predictable a fashion, and isn’t as easily corrected.   It’s educational to bring your board near sources of magnetic interference, and watch how the constellation will distort, then self-repair over time.


Figure 5: Xtrinsic Sensor Fusion Toolbox for Android – Device View

Figures 5 and 6 are screen dumps from the latest version of the Xtrinsic Sensor Fusion Toolbox for Android.  If you enable display of debug packet information in the preferences screen, you’ll get additional information displayed on the device view:

  • The version of software running on your development board (Version 417 in this case)
  • The number of ARM CPU “systicks” occurring during one iteration of the main sensor fusion loop.  Take this number, divide by the CPU clock rate, and you have the number of seconds required for each iteration through the loop.  For the case above, 514,860/48MHz = 10.7ms.  The number is computed in real time, and changes depending upon which algorithm you are running.
  • The board type you are using (a lot of the boards look alike)

I should mention that all of the above are also shown in the “Device” tab in the Windows-based toolbox.


Figure 6: Xtrinsic Sensor Fusion Toolbox for Windows – Canvas View


Figure 6 shows the new “Canvas View” which was just added to the Android version of the Toolbox.  It demonstrates how we could use the sensor fusion quaternion output to create a wireless pointer.  The accel/gyro and 9-axis algorithms work best.  The 3-axis options are pretty much worthless due to basic limitations of using just those sensors, although I will note that gyro-based air mice are possible, just not with this particular algorithm. Check/UnCheck the “Absolute” checkbox on the Fusion Settings Bar to switch between the “absolute” and “relative” versions of the wireless pointer algorithm.  And be sure to read the “Canvas” chapter of the in-app documentation to get full details about how it works.

Our goal with the new page is to give you everything you need to get started quickly.  Relevant hardware, libraries, tools, training materials and support options have been brought together in one place.  If you already have the CodeWarrior for Kinetis MCUs IDE installed on your Windows machine, and have your development boards on hand, you can be up and running ten minutes from the time you land on the page.  And as always, if you have suggestions or ideas for how to improve things, just drop me a line.

Report from Hilton Head 2014 Solid State Sensors, Actuators and Microsystems Conference


By Eric Levy-Meyers on behalf of MEMS Industry Group

Greetings from the Hilton Head 2014 Solid State Sensors, Actuators and Microsystems Conference. On June 8, I attended the optional Sunday Workshop: Frontiers of Characterization and Metrology for Micro- and Nano-Systems organized by Michael Gaitan of National Institute for Standards and Technology (NIST) and sponsored by MEMS Industry Group (MIG), who gathered a great group of speakers to address this topic.

NIST organized this session for the second time at Hilton Head. This program is designed to facilitate the process of improving the standardization of testing and standards that started at MIG’s Member-to-Member (M2M) Forum in 2010 and led to the NIST/MIG report “MEMS Testing Standards: A Path to Continued Innovation.” It was apparent from the interactions that the industry has realized that cooperation in the precompetitive space of testing and characterization must increase to allow the industry to grow and innovate.

At the Micro-Nano workshop at Hilton Head there were eight fascinating talks followed by a very lively panel discussion about the challenges and issues in MEMS characterization and testing. A few of the juicy conclusions are below. For all the details, be sure to subscribe to MEMSBlog so you can access later this week to get the whole report, which should be ready later this summer (free and available for anyone to download).

Key issues discussed include: 

  • Manufactures and users always find ways to use, and sometimes damage, MEMS devices in ways no designer or tester could predict. An example was a “blow out the birthday cake candles” Smart Phone application that had users blew into the microphone. Well, it took a while to link the app to damaged microphones (whoops).
  • Testers are not the bad guys – but they can deliver results people do not like to hear. But the faster people listen, the faster the devices can be fixed. In fact, “fail fast” can be a good approach to getting the best product out the door the fastest.
  • Since testing of MEMS devices leads to discovering novel failure modes, testing, failure analysis, manufacturing and design teams should be in close and continuous contact, especially in high volume systems.
  • The fact that customers always want devices that have more features and are faster, smaller and cheaper, leads to huge pressure on testing which never seems to have enough time to get ready for production.
  • New device types often require custom testing equipment and procedures, but over time, as these devices become more common, testing can be standardized.
  • It is easy to rely too much on tools instead of engineering intuition. There is no substitute for real world experience.

Calling all Innovators to Help Save Our Oceans


Guest Blog by Matt Huelsenbeck, Team Relations Manager, XPRIZE

A major problem facing the ocean is that air pollution is also ocean pollution. The surface ocean layer has become on average 30% more acidic since the Industrial Revolution due to the absorption of carbon dioxide from the atmosphere. These changes in ocean chemistry, dubbed ocean acidification, threaten many forms of marine life, fisheries, and other vital ocean services. But due to a lack of good tools to measure pH, there is little to no information on how ocean pH is changing on a regional level, or in places like the deep sea. We can’t tackle a problem we know so little about.

Therefore, the XPRIZE Foundation, the leading non-profit that’s solving the world’s Grand Challenges through large-scale incentivized prize competitions, is collaborating with ocean philanthropist Wendy Schmidt to offer $2 million dollars in prizes to address ocean acidification through the development of breakthrough pH sensor technology. The winning pH sensor(s) of the Wendy Schmidt Ocean Health XPRIZE will be radically more accurate, durable, and affordable. This is where you come in.

We are looking for teams of innovators to compete in this once-in-a lifetime competition to help tackle the issue of ocean acidification! Would you or someone you know, be interested in forming or joining a team? Skills as diverse as electrical engineering, materials science, data science, nanotechnology and chemistry could be part of the winning team. Registration is open, but closing soon, and we encourage you to fill out the Intent to Compete form today. By submitting your intent to compete form, you can build or join a team made up of innovators like yourself.

There are two prize purses available (teams may compete for, and win, both purses):

$1,000,000 Accuracy award – Performance focused (First Place: $750,000, Second Place: $250,000): To the teams that navigate the entire competition to produce the most accurate, stable and precise pH sensors under a variety of tests.

$1,000,000 Affordability award – Cost and Use focused (First Place: $750,000, Second Place: $250,000): To the teams that produce the least expensive, easy-to-use, accurate, stable, and precise pH sensors under a variety of tests. 
This is your chance to apply your skills to help improve our understanding of one of the oceans greatest threats, ocean acidification, and win up to $2 million dollars in the process! We hope to see you compete.

MIG Conference Japan Wrap-Up

By Karen Lightman, Executive Director

I am finally over the jet lag and able to share my thoughts from MEMS Industry Group (MIG) Conference Japan, MIG’s inaugural conference in Asia that was held on April 24. But first let me quickly express my happiness to have returned to Japan after a three+ year hiatus. (My last visit was before the tsunami/earthquake.) I ate sushi every day, drank sake, partook of a Japanese bath and consumed green tea (in very large quantities). What a great place to visit.

A few months ago I invited you to spend a week with me in Japan, as there were several partner events that dovetailed with our MIG conference, including the NanoMicro Biz ROBOTECH and MEMS Engineer Forum. On April 23 I traveled to Yokohama to give a keynote at NanoMicro Biz’s 20th annual International Micromachine/Nanotech Symposium.

The conference had been relocated to Yokohama, an impressive “city by the bay” that is only a 30-minute train ride from Tokyo. And while the exhibition site was smaller than previous years, the Symposium was still impressive, and my presentation on “MEMS and Sensor Trends, Paving the Way for the Internet of Things” was well received by a diverse and international audience. I also had the opportunity to represent MIG in our booth and sneak in a few MIG-branded chocolates created for us by the conference organizers (yum) as well as connect with several MIG members and partners in attendance.  

Then it was back to Tokyo to kick off MIG Conference Japan with MIG Events and Program Manager Chivonne Hyppolite. Simply put, the conference exceeded expectations in terms of quality/number of attendees as well as content. I am grateful for the guidance and support MIG received from Mr. Susumu Kaminaga of SKG Partners and Mr. Yoshio Sekiguchi of OMRON; without them, there is no way that the conference would have happened let alone be successful.

What excited me the most about MIG Conference Japan was the originality of the content provided by our keynotes and featured speakers. (Here is the agenda.) The focus of the conference was on navigating the challenges of the global MEMS supply chain. Several of the speakers gave their no-holds-barred view of these challenges, including the keynote from Sony Communications, Takeshi Ito, Chief Technology Officer, Head of Technology, Sony Mobile Communications. Mr. Ito’s shared his thoughts on the future of MEMS and sensors (and in particular, alternative uses for acoustic MEMS), which I found very interesting, and I truly appreciated his end-user/OEM perspective.  I also thoroughly enjoyed the presentation by Leopold Beer, regional president Asia Pacific, BOSCH Sensortec, who explored the criticality of balancing higher integration and rapid product cycles with the need to support multiple applications.

Honestly all the presentations at MIG Conference Japan were impressive, and I am not going to do a play-by-play here for you. (Sorry folks.) But what I will do is urge you to consider attending our next big event in Asia: MIG Conference Shanghai, which will be held September 11-12, 2014 in Shanghai in in partnership with Shanghai Institute of Microsystem and Information Technology (SIMIT) and Shanghai Industrial µTechnology Research Institute (SITRI).

Our Shanghai event will be more focused on the theme of the Internet of Things/Services/Everything as well as the challenges of a global MEMS supply chain. Please join me there to further explore the future of MEMS and sensors. For more information, you can visit our website.  

Bulbs Need Intelligent Lighting Systems

Guest blog from Semico Research

There are over 3,000 companies making LED bulbs.  Regionally, there are countries like China that have 5-year plans which foster the development of leading SSL manufacturing firms while pushing LED lighting on the market.  How many light bulbs do you have in your house?  How many are LED?  How many lights at your workplace? On the streets and freeways?

If you thought the sensor market was large before, with smartphones and fitness trackers, imagine all the sensors and controls that could go into lighting sources and outlets, with the intent of monitoring behavior and finding trends in order to predict how and where our lighting should be installed.

With MEMS, the entire smart home may have sensors.  For example, your walls may have accelerometers built in to help predict and recover from earthquakes.  Bulbs may make use of a MEMS microphone to help determine lighting needs.  As the price of MEMS sensors continues to decline, manufactures should turn their eye to this market.

For example, imagine having the majority of your ceiling be comprised of multiple types of lights, all of which can automatically be adjusted depending on your behavior.  This is important for the home theater system, where in order to play a movie, the screen must be lowered, the system turned on, the curtains closed, etc.  But, with smart lighting controls, the mere act of sitting down on the couch at a particular time of the day could trigger all those other actions automatically with the lights adjusted accordingly.  How can MEMS contribute?

Perhaps even more useful, intelligent lighting can sense commands from other lighting sources without the use of a wired connection.  This effectively creates a 3D map of your environment with the lighting system at the head of it.  No more automatic lights that rely on gestures in order to stay on.  The lighting system of the future will know if there are living creatures in the room or not.  This isn’t far out in the future either, we’re looking at this technology now, and at the point where manufacturing and deployment must work together.

According to the U.S. Department of Energy, 86% of all lighting in residential markets currently have no control system, and 70% of all commercial lighting have no controls.  The market penetration rate is so small, and the potential so large, this is a market you should be keeping an eye on.  That is why Semico is hosting a Smart Lighting Event on April 23rd in Santa Clara to discuss deployment trends and what opportunities and barriers to entry we have to look forward to.  Semico’s CTO, Tony Massimini will be discussing, in particular, how MEMS manufacturers can build a niche within the Smart Lighting market.  Join us and register here.

Next-gen RF MEMS Switch for a Smarter, Faster Internet of Things

By Karen Lightman, Executive Director
Originally appeared on GE Global Research, March 28, 2014

Big Data. Internet of Things. Quantified Self. Connected Home. Connected City. These buzzwords are pretty much everywhere (unless you live under a rock or up a tree), and many of us are excited about the possibilities of connecting to data in intelligent ways that improve our everyday quality of life.

Micro-electromechanical Systems (MEMS) and sensor networks give us access to a more connected and quantified world by making “big data from little data.” (ARM CTO Mike Muller explored the topic at a recent MEMS Industry Group conference held at the 2014 International CES). But what if those little and then big bits of data can’t get out? What if they are stuck on the ever-clogged and expanding Internet Highway? How will I be able to quantify myself and analyze my sleep, eating and exercise habits if the data just stays put on my wearable device? What good will come from all this data then?

The simple answer is that it will be NO GOOD unless the data is conveyed via a robust connection with strong signal quality. A strong “data backbone” ensures that the little data can be quickly and seamlessly combined with other little data, then scrubbed and polished through algorithms to create big data that helps make smart decisions — fast. Sometimes these decisions might be as simple as “get off your butt, Karen. You’ve only walked 2,000 steps today” or it might be as complicated as a sensing microsystems that senses, switches, monitors and makes real time decisions on board planes flying overhead to industrial or healthcare monitoring and diagnostics here on the ground warning system for a jet engine turbine that has struck a flock of birds.

The bottom line is that all the fancy MEMS- and sensor-enabled gadgets in the world won’t reach their potential of truly creating an Internet of Things unless the data itself gets to its destination quickly, safely and efficiently. That’s why I became super excited to hear of GE’s RF MEMS switch that promises to enable increased data transfer speeds, enhanced signal quality, and longer battery life.

The RF MEMS switches developed by the folks at the GE Global Research Center in Niskayuna, NY use a unique material set and proprietary metal MEMS process developed at GE Global Research. This is breakthrough science, to be quite honest; and I am can’t wait to see this technology realized in future mobile devices. LTE-Advanced (also called “true 4G”) is already common in several spots in Asia and is expected to become the benchmark for mobile communications worldwide. GE’s RF MEMS technology will create that backbone, to enable the building of big data from little data on this new level of mobile communications.

In 2012, I had the pleasure of visiting the research center in beautiful Niskayuna. (It was in July not in the winter, mind you.) I learned all about GE’s new class of devices (including the switch) and am excited to see what breakthroughs will be coming from GE in the future.  I also got to dress up in the bunny suit and take a tour of their amazing MEMS foundry. (Read more about my visit by reading my blog.)

It is gratifying to see now that technology making its way into the market, with its promise to span numerous applications — across consumer to commercial and industrial products. I personally can’t wait to have my mobile device with the GE RF MEMS switch, truly enabling a smart and fast Internet of Things.

MEMS – Enter with Care

Written by: Karen Lightman, Executive Director, MEMS Industry Group
First appeared on Solid State Technology, March 27, 2014

MEMS – enter with care. I think that will be my tagline for MEMS Industry Group’s third annual MEMS Executive Congress Europe 2014 recently held in Munich, Germany. The official theme of the conference was the “MEMS-Enabled Life,” and the keynotes and panelists did talk about how MEMS is currently and will continue to improve our quality of life. However, what struck me the most about this conference was how every panelist shared not only the “everything’s-coming-up-MEMS” perspective but also some real honest discussion about the remaining challenges of getting MEMS devices to market on-time, and at (or below) cost.

This was especially apparent on the consumer products panel – which makes sense.  Because nowhere else is the MEMS industry more competitive than in the consumer market. JC Eloy of Yole Développement characterized it best: “The MEMS consumer market is booming, but….” The “but” factor here is that it’s such a tough business that very few startups can enter the MEMS consumer market, the only exception being InvenSense. I’ve often said that MEMS is not for the faint at heart, but these days it really looks to be cutthroat in the consumer business as Bosch and ST duke it out for the #1 spot. My favorite quote from the Congress was a sign of that competitiveness – so coyly stated by Teemu Rämö of Nokia when he introduced himself on the panel: “Nokia, the phone you had before you switched to your iPhone or Samsung.” Yes, remember Nokia. Now the Lumia is best known for its (MEMS-enabled) camera, but alas, not for its mobile phone capabilities.

The perspective on the challenges and opportunities in this competitive field of MEMS was also well detailed by our morning keynote, Rudi De Winter, CEO of X-FAB Group, who spoke of the innovation and diversification of MEMS and how it compares to semiconductor and CMOS manufacturing. De Winter described the challenges this way: “In MEMS there are no elementary building blocks…the physical implementation is very different from CMOS and there is a huge potential for optimization (process, design architecture).” Clearly a leader like X-FAB that is expanding its MEMS capabilities sees the opportunity but is going in with open eyes and an appreciation of the challenges that lie ahead.

The automotive panel, ably moderated by Freescale’s Marc Osajda, also reflected on the challenges in the ever-changing world of automotive. The panelists gave a great overview of the changing landscape. As BRIC (Brazil, Russia, India and China) countries are increasing their demand for cars, they are not necessarily increasing their demand for MEMS-/sensor-laden cars. In fact, Richard Dixon of IHS shared the statistic that only 8% of cars sold in BRIC countries have MEMS/sensors while the average American car has closer to 18. This market diversification is simultaneously creating both real opportunity andbig challenges. But as stated by Christoph Wagner of Analog Devices, “MEMS will always be an innovator in automotive.”

The MEMS in healthcare panelists also discussed the opportunities for MEMS – explaining that the biggest chance for a “killer app” in MEMS is in the health/wellness space. The panelists couldn’t help themselves by discussing the barriers to that killer-app-happy-place, with the biggest one being regulation (no surprise here). But they expressed overall optimism when describing a future where you “bring your own device” to maintain wellness and health, and I look forward to experiencing that world as I envision it — with fewer wait times at the doctor’s office. (A girl can dream, can’t she?)

My highlight of MEMS Congress Europe was definitely hearing the keynote from Klaus Meder, president of Automotive Electronics, Robert Bosch GmbH: “MEMS and our Connected World.” With his enviable-looking presentation slides (like seriously, who does his graphics? I want his/her contact info!), Meder painted an exciting world enabled by MEMS/sensors and truly smart Internet of Things and Services (IoTS). “Internet of things is about sensors everywhere, networks everywhere, analyze everything,” stated Meder. YES! I want that world because that world doesn’t intimidate me or frighten me with its regulations and privacy concerns. I can’t wait for that beautifully intelligent MEMS/sensors-everywhere world. Can you?