Preview of MEMS in Medical/Quality of Life Panel at MEMS Executive Congress US 2012

By Karen Lightman, managing director, MEMS Industry Group

For those of you who have heard me talk about MEMS and Medical/Quality of Life (QoL applications – I don’t shy away from calling it “God’s work.” I still get misty-eyed when I think about my friend’s ten year-old daughter, Anna, who has type 1 Diabetes. Last year I told Anna about technology from MicroCHIPS that (thanks to the wonders of MEMS) will someday enable her to seamlessly and automatically monitor and dose her insulin without having to prick her finger and then calculate and administer a dose before every meal or snack. She’ll get her dignity back and she’ll improve her quality of life.

The Holy Grail in medicine is not diagnosing Diabetes, Alzheimer’s or even obesity; it’s figuring out what’s next and how to deal with it. MEMS technology can and will help to navigate that path.

With MEMS technology fundamental to new medical/QoL devices and applications, understanding opportunities in this rapid-growth market is more important than ever. At MEMS Executive Congress US 2012, we’ve lined up a panel of industry experts to discuss how MEMS continues to play a critical role in the development of new technologies that assist with patient monitoring, diagnostics, therapy and portable health care.

To preview our panel, I’ve invited my moderator, Jeannette F. Wilson, product line manager, Sensor and Actuator Solution Division (SASD) / AISG, Freescale Semiconductor, to introduce our panelists and share her thoughts on what they will discuss.

Choosing a MEMS Foundry

By Karen Lightman, managing director, MEMS Industry Group

While micro-electromechanical systems (MEMS) industry leaders such as STMicroelectronics, Texas Instruments, Hewlett Packard, Robert Bosch and Kionix rely on their captive fabs to meet volume production, the movement toward fabless and fab-lite models continues to gain ground. InvenSense, for example, has always been a fabless company, and even powerhouse Analog Devices uses a hybrid approach, choosing internal and external foundries to produce MEMS die for inertial sensor products. Despite the advantages of having a captive fab, which supporters say includes greater control over both capacity and intellectual property (IP), the primary disadvantage—cost—has spurred the use of third-party foundries.

In addition to cost savings, companies work with third-party MEMS foundries for a variety of reasons. They may want to prove a design, prototype a design that is already proven, or mass-produce a MEMS device. With a multitude of options, choosing a MEMS foundry is not a simple decision.

Pure-play MEMS foundries, such as Silex Microsystems, Micralyne, Teledyne DALSA, Asia Pacific Microsystems, Innovative Micro Technology (IMT) and Tronics do not offer design services but they do offer volume production. Partially captive foundries offer another alternative. They will fabricate MEMS die for outside customers when there is excess fab capacity.

Companies such as A.M. Fitzgerald & Associates, Nanoshift and SVTC specialize in design and rapid prototyping, and also consult with their clients to find the perfect foundry partner. Dr. Carolyn White of A.M. Fitzgerald & Associates, who specializes in design, analysis and fabrication for her firm, explains why foundry selection is so critical in the MEMS industry: “In the IC world, you can potentially have a device ready to ship to customers in 18 months—but not in the MEMS world. Even with an existing prototype (with a proven process flow), it takes time to choose a foundry partner and bring the process flow into production. Foundries first do an initial prototype run, then move to pilot production and finally go to full-volume production. That takes at least a year and a half. Total time to market can be five years and could cost in the range of US$10 million for a new device using the fabless model.”

White says that a foundry partner with the right experience can help companies to overcome common technical and logistical challenges—such as coupled physics, moving parts, environmental exposure, and test and packaging challenges. MEMS also presents design challenges that foundries cannot meet alone, according to White. With few formal standards, diverse tool sets and foundry-specific design rules not yet available for existing simulation packages, companies need good design and process engineers to work with the foundry throughout the process.

Making beautiful music with smart MEMS microphones

MIG is very excited to announce that this article was featured in the “Top Stories” section of EE Times today.

By Karen Lightman, managing director, MEMS Industry Group

Remember what a big hit Guitar Hero was when it first came out? All of us air-guitar amateurs were able to justify and perfect our skills at playing in a rock band—all in the comfort of our family rooms. If you are a MEMS-nerd like I am, you may recall that MEMS played a significant role in the success of the Guitar Hero. (Without the tilt motion-sensing provided by the MEMS accelerometer inside, we might as well be playing “Kumbaya” instead of “Walk this Way.”)

After hearing the beautiful sound achieved with the high-performance MEMS microphone that Rob O’Reilly of Analog Devices demonstrated at Sensors Expo 2012, I have the same kind of anticipation for what kind of rock star(s) this MEMS device might unleash. Because what makes this MEMS mic so different is that the quality of the sound is so clear and perfect that it can make anyone sound like a rock star, sans the million-dollar recording studio. What’s more, my sources at Analog Devices tell me that this new “smart” MEMS is also lower cost.

What makes it smart? According to the folks at Analog Devices, their MEMS microphone technology provides a higher signal-to-noise ratio for better near and far-field performance, flatter frequency response and noise rejection, ultimately producing better quality sound. Throw beam forming, directionality and proximity response into the mix and you have a microphone for a wide range of applications.

MEMS: The Next Revolution is beginning

By Chris Keimel, Editor

Aero Thermal & Mechanical Systems
Niskayuna, NY USA

 

Originally posted on GE Global Research’s blog: Edison’s Desk

More than 50 years ago, Richard Feynman urged the pursuit of micro and nano scale devices.  This pursuit has brought significant advances in micro and nano electronics made possible by the transistor.  More recently, MEMS devices, built from similar materials and leveraging the same tools set at silicon based electronics, have made their way into existence. There is even an industry group dedicated to advancing MEMS. Just a few weeks back, the Managing Director of the MEMS Industry Group stopped by our research center to learn more about our ongoing research.

About 15 years ago, the New York Times published an article about the future of an exciting technology called MEMS. We are living the realization of MEMS technology and today, GE is on the verge of enabling a whole new revolution in MEMS applications. But I digress. First of all, you are probably wondering what MEMS devices are.

Sensonor takes part in a long journey to Mars

Originally posted at www.sensonor.com

 NASA’s remote exploration vehicle, the Curiosity rover just started its exciting exploration of the red planet.

The Curiosity has a large payload of advanced scientific equipment and also includes two high accuracy silicon MEMS pressure sensors for atmospheric analysis. These SW380 silicon MEMS sensor chips are designed and manufactured by Sensonor. We are of course very proud and encouraged by being part of this mission.

This is not the first time that we are part of an exciting distant and demanding mission. The same sensor used in this mission was also used to monitor possible micro leakage in the tires of the landing gears in the NASA’s Space Shuttles as well as in air data computers. While having our products in space and in satellites, this is the mission that is the most exiting one of them all.

Like one of the key process engineers to the SW380, Mr. Henning Sorensen, stated; “it is strange to think that I have handled and processed parts that now are on Mars. I had great fun telling this to my kids and friends.

Sensonor formally started its business in 1985; however the development that led to the current business goes back to 1965 when the first basic MEMS research took place. Since then, the company has established a unique competence in designing and manufacturing high precision MEMS products. It is also worthwhile mentioning that the SW380 was the world’s first high precession MEMS pressure sensors that was manufactured in some 150 thousand units now installed worldwide.

Sensonor is today in the lead in several areas, and delivery products of the highest performance with exceptional reliability and performance. Today’s portfolio of MEMS gyro modules and IMU’s are the highest performing and lowest weight solutions commercially available in the market. We are always looking to improve on the existing solutions in the market, building on our competence and pushing the limits of the MEMS technology.

MEMS Product Development Challenges – Sweet Dreams and Nightmares

By Karen Lightman, Managing Director, MEMS Industry Group

MEMS product development is not for the faint of heart. Though you will see many success stories in the industry, you will also see many failed ventures (did anyone say “telecom bubble?”), several bankruptcies (TeraVicta to name one), gray hair (or no hair), and divorces (sad, but true). And then there are the companies that are just middling along, waiting to break through – we have a duty to help them break out –  now!

That’s why I aptly titled our upcoming 2^nd annual MEMS Industry Group (MIG) workshop with BSAC, on September 19, “MEMS Product Development Challenges – Sweet Dreams and Nightmares.” We have a lot to be proud of in the MEMS industry, but we still have a lot to learn and a lot to improve on in order to grow. We may be a $10B/year industry now; but to get to my dream of “MEMS frickin’ everywhere,” we need to do more.

All year long, MIG’s theme for content and programs has been focused on addressing MEMS product development and commercialization challenges. Our annual technical members meeting, M2M Forum, focused on MEMS new product development and we invited Len Sheynblat of Qualcomm to give a keynote on the real truth about what makes integrating MEMS and sensors into end-use mobile devices so darned hard and complicated: a lack of MEMS standardization. We teased out the differences and nuances between MEMS technology push and market pull; when, what and how it matters and why we should care. We developed a MEMS Technology Development Process Template to help managers navigate the gating process to determine when and if a MEMS device is a GO or NO GO. Additionally, MIG has worked closely with our MIG Technical Advisory Committee (TAC) to ensure the content of our MEMS Education Series webinars is focused on MEMS product development.

The Dirt on the Cleanroom: Silicon Carbide Power Semiconductor Devices

By Ron Olson

Electrical Technologies and Systems
Niskayuna, NY USA

Originally posted on GE Global Research’s blog: Edison’s Desk

As the Wide Bandgap Process and Fab manager for the GE Global Research cleanroom, I wanted to take some time to give you the dirt on our clean room over the next few months. In other words, share with you a bit about the technology we’re developing right now, that will change the future.

Every day in our cleanroom, our technology teams are dedicated to a specific technology such as MEMS, Wide Band Gap, Advanced Packaging, Photovoltaic (PV) and Nano. Below is a quick update from our Wide Band Gap team. If you’d like to learn more about our space in general and our team, check out the short clip below.

Currently, we’re developing Silicon Carbide (SiC) power semiconductor devices, including world-leading SiC MOSFET devices at the 1200V and 3300V rating classes.

These devices are capable of:

• blocking high voltages in the off-state
• conducting current with low resistance in the on-state
•  ultra-fast switching speed and high-temperature operation

These advantages over current technology will allow GE to improve energy efficiency while significantly reducing the size and weight of systems for a wide variety of applications including power converters, general controls, and solid state power distribution based products for GE Aviation, Energy and Healthcare.

Look out in the coming weeks for another update!

Ron & team

Karen’s blog from GE Global Research, Niskayuna

By Karen Lightman, Managing Director, MEMS Industry Group

Perched on a bluff overlooking the Mohawk River in Niskayuna, NY is a powerhouse of industrial R&D; GE’s Global Research Center (GRC). GRC just celebrated its 110 year anniversary. Thomas Edison’s original desk is on display in the entry lobby to prove this point!

The Niskayuna facility is the largest of several GRCs. GE also has centers in Munich, Germany; Bangalore, India; Shanghai, China; Rio de Janeiro, Brazil and San Ramon, California.

The history of invention and innovation that has taken place at GRC to create major new businesses was on display as we walked along the entry hall. Some highlighted examples include x-ray medical imaging, jet engines, magnetic resonance imagers, digital x-ray panels and a number of other world firsts. The Research Center in Niskayuna is one of the world’s largest corporate R&D centers that conducts focused, strategic research and development. This is GE – after all – and GE has the demonstrated ability to identify new business opportunities, utilize its research capacity to develop the required technologies in collaboration with GE businesses, and then to grow these businesses globally. As such, the master plan needs significant R&D capability to back it up.

MEMS Industry Group Showcases the Future of MEMS at MEMS Executive Congress 2012

Suppliers and OEMs to explore MEMS’ connection to emerging apps in biomedical/quality of life, consumer, robotics, smart energy, and more at annual executive conference

MEMS Industry Group (MIG) will host MEMS Executive Congress® 2012, the annual business conference and networking event for the MEMS industry, November 7-8, 2012 in Scottsdale, AZ. Keynote speakers include: Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs, who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safety and security; and Robert Brunner, founder, creative director and partner, Ammunition. Brunner, who first made his name as director of industrial design at Apple Computer, will explore the critical connection between brand identity and connection to consumers—going far beyond the typical form-and-function paradigm of classic industrial design. Industry panels and the MEMS Technology Showcase®—featuring some of the most unique MEMS applications—complete the MEMS Executive Congress 2012 program.

“MEMS is everywhere. From smartphones, tablets and video games to automotive stability control systems, airbag crash sensors and blood-pressure monitors, we are using MEMS to improve our everyday lives in ways that we could have scarcely imagined just a few years ago,” said Karen Lightman, managing director, MIG. “At MEMS Executive Congress 2012, we will take a collective look beyond the mainstream applications of MEMS. Will smartphones become intelligent aids for people with Alzheimer’s or autism? Will we still ‘drive’ or will MEMS-enabled automobiles safely guide us to and from our destinations on MEMS-enabled roads? And where is my MEMS-enabled personal robotic assistant? At MEMS Executive Congress, we will tap some of the most influential, innovative minds in the industry to examine the most pressing business issues affecting the future of MEMS. We will also get up close to some of the best examples of the MEMS inside the machine during our popular MEMS Technology Showcase.”

Accelerometer placement – where and why

By Michael Stanley

Originally posted on Freescale’s The Embedded Beat blog

A question that should be asked during physical design of any product incorporating sensors is: “Where should be sensors be located within the product?” Like almost anything else in life, “It depends … ” is the answer. This post discusses accelerometer placement. We’ll touch on magnetic sensors next time around.

If your application is such that the sensor is statically fixed in space, or at least not rotating, it doesn’t really matter where you mount the accelerometer on your board. But if the device can rotate, things get a lot more interesting.

The rate of change transport theorem, which can be found in any rigid body dynamics textbook, relates the rate of change of a vector r as observed in two different reference frames.  For our purposes, the first is the fixed (earth) frame and the second (body frame) rotates and translates relative to the first.  In equation form:

(dr/dt)_f =(dr/dt)_r + ω X r_r (Eqn. 1)

where the subscripts indicate the frame of reference.