Explore “MEMS Sensor Fusion/Sensor Networks”

November 2-3, 2011
Monterey Plaza Resort & Spa
An annual executive forum promoting the commercialization of MEMS

As engineers combine MEMS devices with integrated circuits to create feature-rich heterogeneous environments, embedded systems have become more complex. Now smartphones may include accelerometers, gyroscopes, magnetometers, silicon microphones, RF MEMS, and even micro-displays, to produce a “full package” of intelligence for end-user applications. These new systems require “sensor fusion,” which intelligently combines data, software and processing from different sensors (including MEMS). And while consumer products and automotive systems top the list for high-volume MEMS consumption, biomedical/healthcare, industrial and energy increasingly use MEMS technology as well.

The panel will discuss the critical issues affecting MEMS systems integration such as: What is the future of “MEMS sensor fusion”—integrating MEMS with ICs and software in the same application (and even the same package) while meeting or exceeding cost, power and performance requirements? How are MEMS sensors producing more intelligent, and pervasive, wireless networks? How might technologies such as Hewlett-Packard’s “Central Nervous System of the Earth” (CeNSE) change our information infrastructure—and what is its potential impact on society?

Featured Speakers

Moderator: Michael Jamiolkowski, President & CEO, Coventor

Panelists:

Please join us Thursday, November 3, 2011, 1:45-2:30 p.m., for the panel, MEMS Sensor Fusion/Sensor Networks, at the seventh annual MEMS Executive Congress.

Register today for MEMS Executive Congress

As a business rather than a technical conference, MEMS Executive Congress provides a unique forum for MEMS solution providers and OEM integrators to exchange ideas and information during panel discussions and networking events. This truly unique two-day event is the year’s must-attend conference for the entire MEMS supply chain.

If you have not registered yet, you can do so via the link below:

Register Now

For more information, please visit www.memscongress.com.

What is sensor fusion?

By Mike Stanley

Originally posted on Freescale’s The Embedded Beat Blog

When a colleague of mine recently asked me “What is sensor fusion?” I had to stop and think. Like Justice Potter Stewart once said, “I know it when I see it.” But as an engineer dealing with this topic every day, I should be able to do better. Eventually I came up with the following:

Sensor fusion encompasses a variety of techniques which can:

  • Trade off strengths and weaknesses of the various sensors to compute something more than can be calculated using the individual components;
  • Improve the quality and noise level of computed results by taking advantage of:
    • Known data redundancies between sensors
    • Knowledge of system transfer functions, dynamics and/or kinematics

Good lord! Sounds like something out of one of my textbooks. It’s more fun to look at it by example.

Continue reading

MEMS in Vegas, Baby

The Consumer Electronics Association (CEA) has a new dance partner—and we’re it! For the first time, MEMS has an official home at CES. MEMS Industry Group (MIG) is pleased to host the brand-new MEMS TechZone and the only MEMS conference program at CES 2012.

MEMS TechZone is a new area of the show floor for companies that are driving the adoption of this exciting technology in mobile phones, game consoles, tablet PCs and other hot consumer-electronic devices. MIG will co-exhibit with several members including Bosch/Bosch Sensortec/Akustica, VTI Technologies and WiSpry. Please contact Karen Lightman if you are interested in co-exhibiting opportunities.

Plan to visit the MEMS TechZone at the LVCC, South Hall 2—and join us for a panel on consumer devices enabled by MEMS which you will NOT want to miss on Wednesday January 12 at 11:30 am in room N254, North Hall of the Las Vegas Convention Center. Register in advance for a special discount!

Stay tuned for more MIG news on MEMS programs/events at CES 2012.

MIG at CES 2012 - MEMS Tech ZoneMEMS TechZone
LVCC, South Hall 2
Sponsor(s): MEMS Industry Group (MIG)

www.cesweb.org/showFloor/techzones.asp#5320

Best Regards,

Karen Lightman
Managing Director, MEMS Industry Group
klightman@memsindustrygroup.org, 412-390-1644 work phone; 412-725-6725 mobile

MEMS Suppliers and OEM End-users to Explore “MEMS in the Mainstream” at MEMS Executive Congress 2011

Business execs to discuss future capabilities, investment opportunities, foundry models; analysts to share market research

MEMS Industry Group (MIG) hosts MEMS Executive Congress 2011, the annual business conference and networking event for the MEMS industry, November 2-3, 2011 in Monterey, CA. Keynote speakers include strategy consultant Aaron Schulman, business director, Toffler Associates, who will explain how global drivers of change will radically transform the behavior of individuals and societies; Scott Livingston, CEO, Livingston Securities, who will examine financing innovation in public markets; and Per Asberg, program director, client partnerships, IBM Rational, who will describe IBM’s role in helping to streamline the development design process for systems in automobiles, electronics and medical devices. Several industry panels and the event’s first application showcase complete the MEMS Executive Congress conference program.

“The MEMS industry is hot,” said Karen Lightman, managing director, MEMS Industry Group. “With double-digit growth rates, volume production surging at captive and commercial foundries, and vertical markets such as consumer, automotive, industrial and biomedical driving new demand for a wide range of MEMS devices, the MEMS industry is well poised for continued growth. Providing a unique brand of information-sharing among MEMS suppliers and OEM end-users, MEMS Executive Congress is the perfect forum for understanding and predicting this growth. If you are in any way connected to the MEMS industry, you must attend MEMS Executive Congress.”

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The Zen of Sensor Design

Contributed by Mike Stanley

Originally posted on Freescale’s Smart Mobile Devices Embedded Beat Blog

About two years ago, I joined the Freescale sensors team, which focuses on accelerometers, pressure sensors, and touch sensors.

Prior to that, I spent a number of years in the Freescale’s microcontroller solutions group, where I was an architect for several digital signal controller and microcontroller product families. One of the first things I learned when I moved into the sensors group was that certain “rules of the game” that relate to microcontroller design needed to be adapted when dealing with sensors. An example is package selection. With most microcontrollers, package selection is based upon number of functional and power pins required, PCB assembly processes targeted and (sometimes) thermal characteristics. Performance considerations are often secondary, if they exist at all. Sensors interact with the real world. Mechanical stresses introduced during both package assembly and PCB mounting can affect electrical performance of the device; often showing up as additional offset or variation of performance with temperature. Even the compound used for die attach has a demonstrable effect on sensor performance, and must be considered early in the design process. Continue reading