-
Search
-
Archives
- June 2013
- May 2013
- April 2013
- March 2013
- February 2013
- January 2013
- December 2012
- November 2012
- October 2012
- September 2012
- August 2012
- July 2012
- June 2012
- May 2012
- April 2012
- March 2012
- February 2012
- January 2012
- December 2011
- November 2011
- October 2011
- September 2011
- August 2011
- July 2011
- June 2011
- May 2011
- April 2011
- March 2011
- February 2011
- January 2011
- December 2010
- November 2010
- October 2010
- September 2010
- August 2010
- July 2010
- June 2010
- May 2010
- April 2010
- March 2010
- February 2010
- January 2010
- December 2009
- November 2009
- October 2009
- September 2009
- August 2009
- July 2009
- June 2009
- May 2009
-
Categories
Category Archives: MEMS News
MEMS News Update
August 30, 2011 – 10:02 pm
MEMS News Update
August 29, 2011 – 10:02 pm
MEMS News Update
August 22, 2011 – 10:02 pm
MEMS News Update
August 18, 2011 – 10:02 pm
MEMS News Update
August 17, 2011 – 10:02 pm
Explore “MEMS Sensor Fusion/Sensor Networks”
August 17, 2011 – 6:08 pm
November 2-3, 2011
Monterey Plaza Resort & Spa
An annual executive forum promoting the commercialization of MEMS
As engineers combine MEMS devices with integrated circuits to create feature-rich heterogeneous environments, embedded systems have become more complex. Now smartphones may include accelerometers, gyroscopes, magnetometers, silicon microphones, RF MEMS, and even micro-displays, to produce a “full package” of intelligence for end-user applications. These new systems require “sensor fusion,” which intelligently combines data, software and processing from different sensors (including MEMS). And while consumer products and automotive systems top the list for high-volume MEMS consumption, biomedical/healthcare, industrial and energy increasingly use MEMS technology as well.
The panel will discuss the critical issues affecting MEMS systems integration such as: What is the future of “MEMS sensor fusion”—integrating MEMS with ICs and software in the same application (and even the same package) while meeting or exceeding cost, power and performance requirements? How are MEMS sensors producing more intelligent, and pervasive, wireless networks? How might technologies such as Hewlett-Packard’s “Central Nervous System of the Earth” (CeNSE) change our information infrastructure—and what is its potential impact on society?
Featured Speakers
Moderator: Michael Jamiolkowski, President & CEO, Coventor
Panelists:
- Dr. Todd Carrico, President, Cougaar Software
- Scott Constien, VP, Product Management and Advanced Development, Enfora
- Peter Hartwell, Distinguished Technologist, Hewlett-Packard Laboratories
- Glenn Hauer, Senior Vice President for Product Management, INOVA Geophysical
Please join us Thursday, November 3, 2011, 1:45-2:30 p.m., for the panel, MEMS Sensor Fusion/Sensor Networks, at the seventh annual MEMS Executive Congress.
Register today for MEMS Executive Congress
As a business rather than a technical conference, MEMS Executive Congress provides a unique forum for MEMS solution providers and OEM integrators to exchange ideas and information during panel discussions and networking events. This truly unique two-day event is the year’s must-attend conference for the entire MEMS supply chain.
If you have not registered yet, you can do so via the link below:
For more information, please visit www.memscongress.com.
MEMS News Update
August 15, 2011 – 10:02 pm



