SUBMISSION DEADLINE: February 29, 2012

MEMS Industry Group® invites you to submit your technical paper on MEMS New Product Development to be part of the research materials for this year’s M2M Forum: Focus on MEMS New Product Development. We are looking for papers on the following topics.

• Product Management and MEMS Technology Development – Topics include, but are not limited to:
  • Product development life cycle (brand new concepts, derivative/next-gen products, transfer to fab/manufacturing readiness)
  • Supply chain perspective on innovation, tool capabilities, and software

• New Product Development – Market Pull vs. Technology Push – Topics include, but are not limited to:
  • Customer vs. technology push for new products
  • Differences between IC and MEMS product development (and design flows)
  • Supply chain considerations for new product development
  • Decreasing time to market

• Technical Challenges Unique to MEMS – Topics include, but are not limited to:
  • Packaging and test
  • Reliability
  • Failure modes
  • Tool capacity and equipment
  • Turnkey MEMS models for system design
  • Standard methodologies for encoding designs

ABOUT M2M FORUM

M2M Forum is a one-of-a-kind technical conference, for MIG members*, with a focus on tackling critical MEMS commercialization challenges. M2M Forum is a neutral forum for discussion, bringing together foundries, equipment vendors, research groups, large companies, start-ups, buyers, suppliers, and other stakeholders for solutions knowledge, networking and resources to support your company’s imminent MEMS commercialization needs.

For complete information about M2M Forum, please visit www.memsindustrygroup.org/m2m

SUBMISSION PROCESS

To submit your proposal, please email your paper title and abstract to Monica Takacs at mtakacs@memsindustrygroup.org. You may also contact Monica with your questions.

For your submission to be considered, it MUST be received by February 29, 2012.

SELECTION PROCESS

• The paper abstracts will be judged by MIG’s Technical Advisory Committee.
• The top five selected papers will be given free registration to M2M Forum and the paper will be included in the M2M Forum conference workbook.
• The author of the best paper will be invited to present the paper at M2M Forum.
• All other papers that are deemed relevant will be included in the M2M Forum conference materials and their authors will be given a coupon code for $50 off of registration to M2M Forum.

Selected authors will be notified the week of April 2, 2012. We look forward to receiving your proposal!

*Although M2M Forum is a members-only conference, this “call for papers” is open to the entire MEMS industry. If you are a non-member and your paper is selected, you will still be able to attend the event by invitation of MEMS Industry Group.

Originally posted on Freescale’s The Embedded Beat Blog

Last week I was lucky enough to attend the Consumer Electronics Show in Las Vegas. Freescale maintained a booth in the MEMS Tech Zone sponsored by the MEMS Industry Group (MIG), and I was on hand for much of the show. When I wasn’t actually manning the Freescale booth, I was wandering around, looking for great sensor technologies and applications. Which is, of course, the topic of this particular blog post.

My favorite product demo was the Parrot AR.Drone demonstration. This four rotor helicopter (pictured below) combines great hardware and software content to yield a unique experience.

Parrot AR.Drone

Drone sensor content includes X/Y/Z accelerometer, X/Y/Z magnetometer, X/Y/Z gyro, 2 ultrasonic sensors and TWO video cameras (one forward and one downward facing). It’s controlled via WiFI from your iPhone, iPad, iPod Touch or laptop (other platforms are planned).

I didn’t get a chance to video tape the CES demo, but the video at this web page (click on the picture to run the video) gives you a fair idea of the Parrot’s capabilities. There is a teardown of the previous version of this product at ifixit.com.

I didn’t have to venture beyond our own Freescale booth for my next selection: the VGo Telepresence Robot by VGo Communications. Approximately 3 feet tall, and equipped for two way audio/visual communication, this sleek little robot is built using a number of Freescale technologies including i.MX applications processor, power management and linear accelerometer. At CES, it was piloted by Freescaler Alex Dopplinger from her home in Alberta, Canada. When challenged by CES attendees to prove she was truly offsite, and not hidden behind a curtain someplace, Alex had her son fetch a snowball from outside for proof. Our thanks to Thomas Ryden, COO & Co-Founder of VGo, for bringing his robot to CES and accompanying Alex about the hall.

VGo Telepresence Robot

Visit the Freescale VGo Robotic Telepresence web page for more details.

Pleo, by Innvo Labs, is a different kind of robot. Designed as a substitute pet, Pleo behaves in an amazingly lifelike fashion. It is designed to interact and learn from its environment.

Pleo and Litter Mate

When you strip the skin off Pleo, you see the underlying “muscles” and skeleton. Pleo includes a broad range of sensors including IR, tilt & shake, touch, binaural microphones and camera.

Pleo Undressed

You should take the time to visit the iFixit 2008 Pleo teardown to see just how complicated this “toy” is.

The Survey Runner Unmanned Ground Vehicle by TOPY serves a more serious role. Think “Fukushima” and you’ve got the right idea. I don’t have a lot of details on the sensor content of this robot, but the one page flyer distributed at CES specifies front and back wide angle cameras and radiation monitor. There are sure to be a wide variety of other sensors both for navigation as well as survey operations.

TOPY Survey Runner Unmanned Ground Vehicle

By the way, if you haven’t read Fukushima Robot Operator Writes Tell-All Blog on the IEEE web site yet, you should. It does a great job of highlighting current capabilities and limitations of today’s generation of remote control robots.

Finally, let me leave you with a warm fuzzy feeling courtesy of Paro, the Therapeutic Robot.

Paro, The Therapeutic Robot

Paro was created for use in Japanese hospitals and extended care facilities where live animals are not allowed. Paro responds to touch by batting its eyes and wiggling like a warm puppy. Who can resist?

Original post: http://blogs.freescale.com/2012/01/21/robot-and-sensor-fun-at-ces-2012/

MEMS Industry Group (MIG) will host its first MEMS Executive Congress® Europe, March 20, 2012 in Zurich. This European edition of MIG’s highly successful executive event features an opening presentation by MIG Managing Director Karen Lightman, keynotes by Audi AG and STMicroelectronics, and panels on innovative uses of micro-electromechanical systems (MEMS) in both established and emerging markets.

“MEMS is a global industry, and the European region is a powerhouse in automotive systems, industrial automation and energy creation/conservation, and mobile communications. European companies and organizations are also applying MEMS to biomedical applications in ways that will truly improve our quality of life,” said Karen Lightman, managing director, MEMS Industry Group. “Attendees of MEMS Executive Congress Europe will gain real-world insight into product enhancements now made possible through the intelligence and versatility of MEMS.”

MEMS EXECUTIVE CONGRESS KEYNOTES

• Carmelo Papa, senior executive vice president and general manager, Industrial & Multisegment Sector, STMicroelectronics: With his experience in recognizing its potential and supporting the business with appropriate resources, Mr. Papa will discuss why MEMS has seen explosive growth over the past half-decade, how ST has contributed to that growth with its recognition of the consumerization wave, and why the potential for future growth is limited only by imagination. Mr. Papa will highlight several future MEMS opportunities and will challenge the audience to think beyond the usual to innovate using MEMS.
• Markus Buhlmann, head of unit, Chassis Electronics, Vehicle Dynamics/Software, Audi AG: Mr. Buhlmann will describe how MEMS is enabling a new level of automotive safety, comfort and functionality, presenting Audi’s central inertial sensors’ integration platform, “Sensory Array Audi” (SARA)—which makes sensor data available for the most varied vehicle functions on a cross-system basis. Mr. Buhlmann will also address the collaboration among MEMS suppliers, Tier 1 suppliers and automotive manufacturers as well his vision of the car of the future.

MEMS EXECUTIVE CONGRESS EVENING SPEAKER

• Henry Baltes, professor emeritus, ETH Zürich, Micro and Nanosystems: As a professor of physical electronics at ETH Zürich and director of the physical electronics laboratory from 1988 to 2006, as a pioneer in the field of biosystems science, and as co-founder of both Sensirion AG and LSI Logic Corporation of Canada, Mr. Baltes will draw upon his extensive experience to present an overview of micro- and nanosystems at ETH during an evening dinner presentation.

MEMS EXECUTIVE CONGRESS PANELS

MEMS Enabling Smart Industrial Systems: MEMS is enabling a revolution in smart systems for industrial automation, including smart buildings, and even smart cities. Panelists will explore how MEMS is helping to manage the world’s increasing energy-related challenges, such as reducing emissions and energy consumption, monitoring and reporting energy usage, and energy harvesting. Moderated by Per Slycke, CTO and founder, Xsens, with panelists:

• Burkhard Habbe, vice president, business development, Micropelt GmbH;
• Nicolas Leterrier, strategy & innovation, France, innovation director, Schneider Electric;
• Nico de Rooj, vice president, Microsystems Technology, CSEM; and
• Dr. Thomas Scheiter, global owner of Microsystems R&D, Siemens.

MEMS and the Changing Automobile: Advancements in automotive safety systems and alternative-energy vehicles are a big part of our future. A panel of industry experts will discuss what’s next, from zero-emission cars to cars that drive themselves. Moderated by Jiri Marek, Senior Vice President of Engineering Sensors, Automotive Electronics Division, Robert BOSCH GmbH, with panelists:

• Richard Dixon, senior analyst, MEMS & Sensors, IHS iSuppli;
• Hannu Laatikainen, executive vice president, Transportation Business, VTI Technologies;
• Marc Osajda, global automotive strategy manager, Freescale Semiconductor; and
• Bernhard Schmid, Manager Sensor System & Technology Center Chassis & Safety Division, Continental Teves AG & Co. oHG.

MEMS and Quality of Life: MEMS is enhancing quality of life (QoL) in a variety of ways. Panelists will discuss technologies and commercial opportunities in the medical sciences, ranging from the lab and clinical care to patient monitoring, management, rehab, replacement and drug delivery. Moderated by Jo De Boeck, CTO, imec corporate; with panelists:

• Chris Baten, program manager, Roessingh Research and Development;
• Dr. François Berger, director, CEA Leti – Clinatec;
• J.W. (Hans) Hofstraat, vice president, Philips Research Healthcare Strategic Partnerships, Philips Research Laboratories; and
• Frédéric Neftel, MD, president & CEO, Debiotech SA.

MEMS in Consumer Products: From smartphones and tablets to game controllers and digital cameras, MEMS is changing the user experience with consumer products. Thanks to a reduction in prices, a more robust software ecosystem and better infrastructure, which is accelerating MEMS production, consumers are demanding—and receiving—more functionality in their products. Panelists will discuss how European companies are among the world’s leaders in the innovative use of MEMS for consumer products. Moderated by Stefan Finkbeiner, CEO, Akustica, with panelists:

• Jean-Christophe Eloy, founder and president, Yole Développement;
• Andre van Geelen, executive vice president & general manager, EPCOS Netherlands B.V.;
• Terho Lahtinen, manager, Product Concepts & Innovation, Suunto; and
• Sauli Palo, principal specialist, Component Quality and Technology, Nokia Corporation.

ABOUT MEMS EXECUTIVE CONGRESS EUROPE

MEMS Executive Congress Europe brings together business leaders from a broad spectrum of industries: automotive, industrial/energy, biomedical/quality of life, and consumer goods. It is a unique professional forum at which executives from companies designing and manufacturing MEMS technology sit side-by-side with their end-user customers in panel discussions and networking events to exchange ideas and information about the use of MEMS in commercial applications.

Sponsors of MEMS Executive Congress Europe (as of January 25, 2012) include: include: Platinum Sponsor – EV Group; Gold Sponsors – Applied Materials and SPTS Technologies; Silver Sponsors – Analog Devices and Semefab; and Bronze Sponsors – A.M. Fitzgerald & Associates, Asia Pacific Microsystems, GSA and IVAM. Additional sponsors include ACUTRONIC, AEPI,  Bosch, Bosch Sensortec, CEA Léti, CSEM, Freescale Semiconductor, Fries Research & Technology (FRT), IHS iSuppli, imec, Maxim, MST BW: Mikrosystemtechnik Baden-Württemberg, Okmetic, Smart Systems Integration, Solid State Technology, SVTC and Yole Développement.

MEMS Executive Congress Europe will be held March 20, 2012 at the Hotel Novotel Zurich Airport Messe, Zurich, Switzerland. It is conveniently co-located with Smart Systems Integration 2012. Attendees will receive a 20% discount for attending both events, and an early registration rate is available until February 20, 2012.

FOR MORE INFORMATION

For more information, please contact MIG via phone: +412/390-1644, email: info[at]memsindustrygroup.org or visit MEMS Executive Congress at: www.memscongress.com.
For press and analyst registration, please contact Ingrid Daschner, European public relations on behalf of MIG, tel: +49 (0)89 89 40 85-11, email: ingridd[at]johnsonking.de.

ABOUT MEMS INDUSTRY GROUP

MEMS Industry Group (MIG) is the trade association advancing MEMS across global markets. More than 130 companies comprise MIG, including Analog Devices, Applied Materials, Robert Bosch GmbH, Freescale Semiconductor, GE, Honeywell, HP, Intel, InvenSense, Nokia, STMicroelectronics, Qualcomm, Texas Instruments, VTI Technologies and WiSpry. For more information, visit: www.memsindustrygroup.org.

PRESS CONTACTS

Karen Lightman, MEMS Industry Group
Phone: +1 412/390-1644
Email: klightman[at]memsindustrygroup.org

Ingrid Daschner
Phone: +49 (0)89 89 40 85-11
Email: ingridd[at]johnsonking.de

Originally posted on Design News

MEMS has been present at the Consumer Electronics Show (CES) for over a decade, but nobody knew it was there except for a handful of plugged-in engineers. Finally this year, MEMS received the respect and accolades it deserves. I am pretty sure it had something to do with the fact that MEMS Industry Group (MIG) hosted the first MEMS TechZone and MEMS conference track, “Connecting the Real World with the Digital World: Harnessing the Power of MEMS.”

It also had a lot to with the prevalence of MEMS in today’s consumer electronics. These have enabled enhancements consumers expect in the next generation of consumer devices. This new trend was a big part of the discussion at the CES conference track featuring Bosch Sensortec’s Frank Melzer, Freescale’s Seyed Paransun, VTI’s Sten Stockmann, WiSpry’s Jeff Hilbert, and myself as the moderator. I told the audience that if you want to be part of consumer electronics, you’re going to need to have MEMS inside your device.

According to Hilbert: “We’re at a tipping point for MEMS where it’s becoming more generally available and usable. Companies are not just selling technology; they are providing total solutions. A decade ago MEMS companies began with sensors collecting data about the real world. Then they added processing; followed by the ability to act and then interact, which gave us the possibility of learning.”

Continue reading

Originally posted on ElectroIQ

January 17, 2012 — Micro electro mechanical system (MEMS) microphones are set to enjoy another blockbuster year in 2012 as the devices continue to find strong adoption in portable electronics, including the wildly popular iPhone and iPad from Apple Inc., according to a new report from IHS iSuppli.

Revenue this year for MEMS microphones is projected to reach $493.5 million, up a solid 32% from $373.2 million in 2011. This year’s expansion continues the mighty growth path seen by MEMS mics following last year’s remarkable 64% increase, and the next few years also will see healthy prospects for the space.

By 2015, MEMS microphone revenue will hit approximately $667.0 million, equivalent to a five-year compound annual growth rate (CAGR) of 24% starting from 2010. Shipments in 2015 will hit 2.9 billion units.

Continue reading

Introduction by Karen Lightman, managing director, MEMS Industry Group

“I was honored to host the first-ever MEMS conference session at CES on January 11, along with my MEMS TechZone Co-exhibitors (Bosch Sensortec, Akustica, Freescale Semiconductor, VTI Technologies, and WiSpry). The panel was a lot of fun and very well received, with over 100 attendees. But I was over the moon when I saw the headline in James Niccolai’s piece “MEMS Devices Swarm Over CES!” Stay tuned for my blog from 2012 CES, where I’ll share my thoughts on how MEMS is the star this year”

By James Niccolai, IDG News Service

MEMS, or microelectromechanical systems, are all over the 2012 Consumer Electronics Show, though you might not know it unless someone told you. They’ve become a vital component in smartphones and tablets and are also used in printers, pico-projectors, digital cameras, microphones and hundreds of other products on the CES show floor.

MEMS are typically computer chips with a microprocessor and a sensor on board, for detecting movement, orientation and other changes in the surrounding environment…

MEMS TechZone LVCC, South Hall 2, Booth #25218 January 10 – 13, 2012 Stop by the booth to register to win MOD Live from Recon Instruments (winner of the 2011 MEMS Technology Showcase at MEMS Executive Congress®) and see the VGo Robotic Telepresence (enabled by MEMS developed by Freescale Semiconductor.)

MEMS Conference Session Connecting the Real World with the Digital World: Harnessing the Power of MEMS LVCC, North Hall, Room N254 January 11, 2012 | 10:30-11:30amSpread the word to your colleagues and customers to attend this much anticipated session. In this session, you’ll earn how MEMS is truly driving the adoption of new consumer applications and products.

Complimentary MIG Networking Breakfast

Sponsored by 

Conference Room 7, Second Floor, Las Vegas Hilton
January 11, 2012 | 7:00-9:00 am

Join press and members of MIG for a complimentary continental breakfast and networking time. (RSVP required) MEMS at 2012 CES^® PressroomIf you can’t make it to the show, be sure to check out the latest press releases related to MEMS at 2012 CES^® in our online press room.  MIG members, if you are attending the show and have a press release, make sure to send it to Kacey Wherley at kwherley@memsindustrygroup.org for inclusion.

See you in Las Vegas!

MEMS Industry Group is pleased to announce MEMS Executive Congress® Europe. The European edition of MEMS Executive Congress explores the global connection of the MEMS supply chain. This one-day executive event features an opening presentation by MIG Managing Director Karen Lightman, panels, keynote speakers, and a special dinner at ETH Zurich. MEMS Executive Congress Europe is conveniently co-located with Smart Systems Integration 2012.

Featuring Keynote Speakers: Markus Buhlmann, Head of Unit, Chassis Electronics, Vehicle Dynamics/Software, Audi AG Carmelo Papa, Senior Executive Vice President and General Manager, Industrial & Multisegment Sector, STMicroelectronics Panel Topics: MEMS Enabling Smart Industrial Systems MEMS and the Changing Automobile MEMS and Quality of Life MEMS in Consumer Products	Location & Hotel Information: Hotel Novotel Zurich Airport Messe Lindbergh-Platz 1 8152 Glattpark Zurich, Switzerland +41 44 829 90 00

MEMS Industry Group Invites Press to First MEMS TechZone, with Akustica, Bosch Sensortec, Freescale Semiconductor, VTI Technologies, WiSpry Co-exhibiting

2012 International CES

MEMS TechZone Debuts at 2012 CES

MIG is sponsoring MEMS TechZone, a new area of the 2012 International CES exhibition showcasing companies that are driving the adoption of MEMS in consumer products. MIG’s co-exhibitors include:

• Akustica, Inc., a Bosch Group company providing the world’s smallest single-chip MEMS microphones for improved voice capture in laptops, tablets, mobile handsets, headsets and other electronic products;
• Bosch Sensortec GmbH, a Bosch Group company delivering geomagnetic sensors, triaxial accelerometers, barometric pressure sensors and a comprehensive software portfolio for consumer and industrial applications;
• Freescale Semiconductor, a global provider of intelligent sensors, logic and customizable software for smart portable electronics, quality of life/biomedical systems, computer peripherals, wireless devices and automotive electronics;
• VTI Technologies, a leading supplier of acceleration, inclination, angular rate and pressure sensor solutions for automotive, medical, instrument and consumer applications; and
• WiSpry, Inc., a fabless semiconductor company that brings significant performance improvements, size and cost reduction benefits to mobile handset manufacturers and network operators through its dynamically tunable radio frequency (RF) MEMS devices.

“Harnessing the Power of MEMS” Conference Session

MIG’s Karen Lightman will moderate a conference session, “Connecting the Real World with the Digital World: Harnessing the Power of MEMS,” featuring industry executives whose companies are changing the very nature of consumer products. Featured panelists will be:

• Jeff Hilbert, President & Founder, WiSpry;
• Frank Melzer, PhD, General Manager and CEO of Bosch Sensortec;
• Seyed Paransun, Vice President and General Manager, Sensor and Actuator Solutions Division, Freescale Semiconductor, Inc.; and
• Scott Smyser, Vice President & General Manager North America & Co-Founder, Timing Devices, VTI Technologies, Inc.

Schedule of Events

MIG Managing Director Karen Lightman and executives from MEMS TechZone and the MEMS conference session are available for interview during the 2012 International CES, January 10-13, Las Vegas, NV. MEMS TechZone is located at the Las Vegas Convention Center (LVCC) South Hall 2, Ground Level, Booth #25218.

The MEMS conference session, “Harnessing the Power of MEMS,” will take place January 11, 2012, 10:30-11:30 a.m., LVCC, North Hall, Room N254.

MIG also invites the press to enjoy a networking breakfast sponsored by STMicroelectronics, January 11, 7-9 a.m., Las Vegas Hilton, Second Floor, Conference Room 7. Advance registration is required; please contact MIG for an invitation.

Media Inquiries

To schedule a tour of MEMS TechZone, attend the MEMS conference session or register for MIG’s networking breakfast, please contact Maria Vetrano, media relations, MEMS Industry Group, tel: +617.876.2770, email: maria[at]vetrano.com.

ABOUT MEMS INDUSTRY GROUP

MEMS Industry Group (MIG) is the trade association advancing MEMS across global markets. More than 130 companies comprise MIG, including Analog Devices, Applied Materials, Robert Bosch GmbH, Epson Electronics America, Freescale Semiconductor, GE, Honeywell, HP, Intel, InvenSense, Nokia, Qualcomm CDMA Technologies, STMicroelectronics and Texas Instruments. For more information, visit: www.memsindustrygroup.org.

MEMS Industry Group and the MEMS Industry Group logo are registered trademarks of MEMS Industry Group. All other product and company names are trademarks or registered trademarks of their respective holders.

Contacts