Analyst Corner: MEMS market will continue double digit growth, to double by 2017

Fast growing inertial sensor and microfluidics demand will drive a doubling of the MEMS market to $21 billion by 2017, as total unit shipments ramp at a 20% CAGR.

Contributed by Yole Développement

By Eric Mounier, Senior Analyst, MEMS Devices & Technologies, Yole Développement and Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies, Yole Développement

MEMS will continue to see steady, sustainable double digit growth for the next six years,with 20% compound average annual growth in units and 13% growth in revenues, to become a $21 billion market by 2017. That’s a slight slowdown from the industry’s 17% jump in 2011, as the initial rush of adoption of inertial sensors in smart phones cools a bit, inertial sensor prices continue to fall, and demand for inkjet heads slips a bit more. We expect continued strong growth in motion sensing and microfluidics means those sectors will increasingly come to dominate the MEMS market totals, making up almost half of the overall market in 2017, with accelerometers, gyros, magnetometers and combos accounting for about 25% of the total, and microfluidics for 23%.

Strong growth to continue in inertial sensors, 3-axis gyro remains the hot consumer product

There’s plenty of room for the motion sensor market to grow for at least the next three years, as penetration increases in growing end markets, for a $5.2 billion opportunity by 2017. But competition, falling prices, maturing markets and increasing integration also mean overall CAGR in this large market will be held to about 8%.

On the consumer side, accelerometers are already in almost all smart phones, but the overall cell phone market is still growing quickly, projected to grow by another 1 billion units by 2017. More of these phones will also be smart phones, the total likely doubling from 450 million to 900 million within the next three years, and MEMS are also now starting to be designed into more feature phones as well. The penetration of gyros jumped from 9% of smart phones in 2010 to 36% in 2011. Within two to three years, however, every smart phone will have a gyro.

Many phones may in fact start to have two gyros, as phone makers increasingly see image stabilization as a key way to differentiate their products with better photo quality. InvenSense targets the camera module suppliers with for its precision gyro for image stabilization, arguing it makes things easier for the phone maker. STMicroelectronics offers a dual core solution instead, with both a high precision sensor for image stabilization and one more suited to gaming in a single package, but as this requires a more complex ASIC it may not necessarily be the cheaper solution.

AKM still dominates the magnetometer business with some 78% market share with its Hall-based device, and tight integration into the InvenSense modules and software. But other suppliers, from STMicroelectronics and Robert Bosch to MEMSIC, argue that their alternative technologies are more accurate and use less power, and that they can better integrate the devices they make themselves.

The market for combo sensors started in 2011, with 6-axis accelerometer and magnetometer combo units with a single ASIC shipped in volume, and 6-axis accelerometer and gyro units now starting to do so as well, often for only a small additional cost for the accelerometers. Stand alone components are still by far the biggest business, but in two to three years successful companies will be selling 6X or 9X devices.

To better track these important developments, we have broken out a separate category for combo sensors in our market data and forecasts this year. We believe that the market for discrete sensors will begin to decline, but the growth for combo solutions will be huge. Though currently less than a $100 million niche, we expect combos to be a $1.7 billion opportunity by 2017.

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Healthcare Applications Based on MEMS Technology

MEMS in HealthcareContributed by Xsens

Pietro Garofalo, Business Developer in Healthcare Applications at Xsens has recently published an article entirely dedicated to the application of MEMS technology in the Healthcare Market. Pietro explains the logic behind it:

“The core business of Xsens is directly linked with our capability of introducing MEMS technology in the market with different levels of complexity. Our expertise allows MEMS to reach many levels of application where different accuracy, reliability and scenarios are required. From an individual motion tracker to integration of MEMS with Ultra Wide Band technology, the article explains what are the minimum requirements to make inertial sensors applicable for healthcare applications”

Read more in Advancing MicroElectronics magazine (pdf)

 

 

 

Slideshow: MEMS in the midnight sun

Original post by Peter Clarke, EE Times

Recently I was fortunate enough to be invited on a tour of the vibrant MEMS cluster that exists in the hinterland immediately north of Helsinki, Finland. I arrived at Helsinki airport on the evening flight from London at 11pm and it was still a relatively bright twilight.

Next morning the weather was warm and cloudless and it was off to MEMS wafer maker Okmetic Oyj in Vantaa.

Okmetic’s wafer making faclity in Vantaa, Finland. Expansion to allow manufacture of more thick-SOI wafers for MEMS applications is taking place on the far side of the building.

 

Click to continue reading

 

 

 

 

MEMS Industry Group Tackles Critical Technical Issues Affecting MEMS

MIG members discuss product development, integration, standardization at M2M Forum

PITTSBURGH—May 29, 2012—MEMS Industry Group® (MIG) engaged technology leaders attending its annual technical conference for members, Member to Member (M2M) Forum, on the most pressing challenges affecting the micro-electromechanical systems (MEMS) industry. Held May 8-10, 2012 in Pittsburgh, M2M Forum® began with a tour of Carnegie Mellon University’s (CMU’s) microsystems labs, offering a rare opportunity to engage with engineers at one of the world’s top R&D institutions. Through interactive working group sessions, presentations and panels, M2M attendees discussed critical issues influencing new MEMS product development, to advance the commercialization of MEMS through a fertile information exchange.

“MEMS Industry Group is focused on building the business of MEMS, and that includes exploring technical challenges, product innovation, commercial successes and emerging trends,” said Karen Lightman, managing director, MEMS Industry Group. “Our ability to cover so much ground in just two days of M2M Forum—from the CMU labs’ tour and Qualcomm CDMA Technologies’ Len Sheynblat’s call for sensor-integration standardization to heated discussions around product-development strategies—validates MIG’s position as a neutral organization that fosters the exchange of ideas, for the betterment of the MEMS industry as a whole.”

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Karen’s Blog – MEMS Isn’t New

MEMS New Product Development

What do you think of when I say the words “MEMS new product development?” Do you envision new categories of newly discovered MEMS hatching somewhere in a university lab? If your answer is “yes,”, perhaps you should rethink that– because MEMS isn’t new.  If we are to grow this $9 billion/year industry to a hundred-billion or even trillion dollar industry as some predict, we need to think of new MEMS in terms of how the “regular, everyday” MEMS we have right now are used in development of new end products.  Whether these new MEMS-enabled products come from a combination of market pull and/or technology push, there are challenges and hurdles that the industry must come together to address. NOW.

That is why we focused the MEMS Industry Group (MIG) Member-to-Member (M2M) Forum on MEMS “New Product Development” earlier this month. Because it is so time-critical for the MEMS industry to come together and address these barriers and challenges to commercialization that are hindering our growth. Barriers that I like to call the “stickiness of MEMS” which include the “S” word of MEMS “Standards” for things such as testing, packaging…not the sexy, shiny, bright things that are hatched in the lab and then probably never make it to the market.

That is why I invited Len Sheynblat of Qualcomm CDMA Technologies (QCT) to give the keynote “Sensor Systems Integration Challenges,” which spelled out in very specific terms what the MEMS industry needs to do – specifically – Sensor API Standardization. He shared QCT’s commonly requested sensor vendors: 18+!! With 26+ sensor product lines! And on top of it – there are numerous handset and tablet OEMS with different ecosystems = Android, Windows, RIM (which used to be Palm), etc.  They all want to be loved, and this makes developing with MEMS just a smidge complex.

Sounds a bit nightmarish, don’t you think? I sure do… and MIG will be working with our members and strategic partners, including the MIPI Alliance, to address these challenges and issues of the stickiness of MEMS. I urge you to contact me and become active and involved in our M2M Action Item Task Forces.

That’s also why the MIG Technology Advisory Committee (MIG TAC) chose Mary Ann Maher, CEO of SoftMEMS, as the winner of our first-ever white paper competition, because she discussed the important issue of co-design and yes, standards. And because Mary Ann was the evening speaker, she also made the presentation into a drinking game. (Every time she said “co-design” you were to take a sip; I gave up after the 15th time.)

And as we have every year, since MIG began with DARPA funding, we also had working groups to dive deeper into the conference topic. Our working group leaders (Jim Knutti of Acuity, Mike Mignardi of TI, Jason Tauscher of MicroVision and Valerie Marty of HP) did a fantastic job of moderating the rich discussions we had in the working group breakout groups on “Market Pull vs. Technology Push” and “MEMS Technology Development.” I encourage you to check out the MIG resource library to see the body of knowledge and case studies we’ve gathered; and MIG action item task forces will be forming soon to carry out several of the recommendations.

M2M Forum also featured a panel of speakers expressing diverse opinions and perspectives on new product commercialization—from those involved heavily and not so heavily with MEMS. The panel included: Anne Schneiderman of Harris Beach, an expert in IP law; Stefan Finkbeiner, a MEMS device manufacturer veteran with Bosch/Akustica; Matt Apanius with SMART Commercialization Center for Microsystems, who is well versed in tech transfer from lab to fab; and Ivo Stivoric with BodyMedia, someone who embodies a MEMS supplier’s dream of an end-user company.

My favorite part of the panel was when Ivo described the challenges in understanding/analyzing the “white space in the market.” He warned that as a consumer of MEMS, he oftentimes doesn’t need a new device; he just needs a tweak or two and then wants the device manufacturer to “just go away” so he can go back to his customers. Amen, brother. I want that for you, too. Because the truth is that MEMS isn’t new, and so we need to find the solutions to these challenges to commercialization, and then move on to conquer the other white space in the market.

For more information on M2M Forum, please read the recent press release: MEMS Industry Group Tackles Critical Technical Issues Affecting MEMS)

InvenSense Motion Interface Developers Conference

 

 

 

 

 

The 2012 InvenSense Motion Interface Developers Conference will bring together System OEM’s, Ecosystem Partners, Application Developers, and Industry Analysts to learn about the technologies, market and future applications for Motion Interface in smartphones, tablets, and health and sports monitoring.The market for Motion Interface technologies, including gyroscopes, accelerometers and magnetometers, is expected to exceed $2.5B by 2015. Applications such as indoor location based services are continuing to fuel growth for Motion Interface in smartphones and tablets. At the same time, new markets are emerging for wearable sensors in fitness and medical applications.

This all day event features a market review from recognized Motion Interface analysts, application specific panel discussions, including recognized leaders in the fields of location based services and wearable sensors, and developer-focused technology tracks covering performance requirements and design considerations for products embedding Motion Interface technology.

The event will be held at the W Hotel in San Francisco on June 14, 2012. The Early Bird Registration Price is $149 lasting until May 25th at which time Regular Admission price goes up to $199. This event provides a unique opportunity for CEO/CTO/Marketing VP/Eng VP for Mobile Applications, Mobile Ecosystem Partners, Embedded System Developers, Mobile App Developers, Product Planners, Financiers, Venture Capitalists, Investment Firms, Industry Analysts, and Technology Media

Invited Speakers and Attendees include: Qualcomm, iSuppli, Broadcom, Texas Instruments, Google, Nvidia, Intel, PointInside, Verizon, Wired Magazine, A.M. Fitzgerald & Associates, Prioleau Advisors, LUMOback and many more…

Click here to view event website

Guide to MEMS at SEMICON West 2012

Here’s our annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco:

TUESDAY, July 10, 10:30am-3:30pm

Taking MEMS to the Next Level: Transitioning to a Profitable High-Volume Business

Presented in cooperation with MIG

We’ve expanded the MEMS program to all day this year, and invited speakers from around the world to address practical potential solutions to the major manufacturing issues for growing the sector to the next level. Yole Développement’s J.C. Eloy will give his views on the future of the industry and what it will take to get there. Harmeet Bhugra will talk about IC maker IDT’s entry into the MEMS timing business. Doug Sparks from the new Chinese MEMS IDM Hanking Electronics talks about the opportunities in the China market.  Foundry executives Donald Robert from Teledyne Dalsa and Peter Hrudey from Micralyne examine possible collaborative solutions to speed time-to-market.  Hillcrest Labs CTO Charles Gritton talks about issues of software integration and sensor fusion.

On the manufacturing technology side, Coventor’s Matt Kamon tells us what’s coming next in MEMS design automation software, Applied Materials’ Mike Rosa talks about next-generation DRIE and other new processes being developed specifically for MEMS production, and Nikon’s Jumpei Fukui discusses the advantages of mini-steppers. In addition, Finnish startup ScanNano’s CEO Andrei Pavlov presents his work making low-cost cavities without etching and NIST’s Janet Cassard introduces standard reference materials and best practices for consistent characterization and troubleshooting of processes for calibrating instruments and communicating between customers and suppliers.

Location: Extreme Electronics TechXPOT at Moscone Center (South Hall). The stage is in the same place as last year, in the far back right-hand corner of the Moscone South exhibit hall.

WEDNESDAY  July 11

1:30-2:20pm

Secondary Market Issues

Jack Blaha of Applied Materials’ 200mm group and Bill Ross of SEMATECH talk about collaboration on replacement parts to keep legacy equipment up and running

Location: TechXPOT South, Moscone Center (South Hall)

5:00-7:00pm

MIG Happy Hour

MIG will host its annual Happy Hour at SEMICON West.  To RSVP, please email Kacey Wherley at kwherley@memsindustrygroup.org.

Location: Restaurant Lulu
816 Folsom Street, San Francisco, CA

THURSDAY, July 12, 10:30am-12:30pm

MEMS and Sensor Packaging

The SEMI Packaging Committee presents a program focusing on MEMS packaging technology issues, featuring Analog Devices’ Asif Chowdhury on issues of packaging MEMS for industrial applications, and Yole Développement’s Jerome Baron on the roadmap for MEMS packaging going forward. Florian Solzbacher from the University of Utah’s Utah Nanofabrication Laboratory presents on biomedical packaging issues, while Marc Bachman from the University of California talks about the future of MEMS manufacturing.

Location: TechXPOT North, Moscone Center (North Hall)

THURSDAY, July 12, 11:45-1:00pm

Flexible Batteries and Flexible Mounting of Thinned Silicon Die on Textiles, Skin Patches and Implants

MEMS folks interested in integrating sensors into innovative wearable, flexible, implantable applications may want to check out presentations in the Plastic Electronics program on patterning flexible batteries on unconventional substrates and embedding thinned conventional silicon die into flexible polymer packaging, from companies who don’t typically show up at MEMS events.  Imprint Energy talks about its low-cost, high-energy density Zn polymer battery technology suitable for wireless and wearable sensors, Applied Materials presents its lower cost technology for making thin film batteries, and MC10 describes its conformal electronics packaging targeted at wearable and implantable sensors.

Location: Extreme Electronics TechXPOT, Moscone Center (South Hall)

For more information on SEMICON West 2012, please visit www.semiconwest.org.  To register, click Register now.

Karen’s blog – Why You MUST attend M2M Forum 2012

By Karen Lightman, Managing Director, MEMS Industry Group

You must attend M2M Forum 2012 May 8-9 in Pittsburgh. If you are involved in MEMS in any way as a manufacturer, end-user/OEM, equipment or materials supplier, designer, or integrator – you HAVE to be here for M2M Forum this year when we uncover the HOLY GRAIL of successful MEMS.

We will be sharing success stories and exchanging lessons learned! We will be having honest conversations in a neutral forum about what works, what doesn’t, why and WHAT WE CAN DO ABOUT when it comes to taking a MEMS device from lab, to fab to commercialization.

Maybe you saw my video clip on the M2M homepage (and on YouTube). It’s a short simple message of “be there or be square” – but to get a real taste of what we’ll unveil at M2M Forum you should check out the webinars that our working group moderators have hosted as part of our MEMS Education Series.

The one on “Market Pull vs. Technology Push” featured Mike Mignardi of TI and Jim Knutti of Acuity as well as MIG’s consultant, Eric Levy-Meyers. To quote one of the comments from the webinar audience “this is great, you guys should write a book.” Yup, you guys should and guess what: THEY WILL BE DOING THE REAL THING LIVE IN PITTSBURGH ON MAY 8-9.  Mike and Jim will share stories of success and failure – when it was tech push (like the DLP going into the pico projector) and when it was clearly market pull (tire pressure sensors, airbags, microphones). There is GOLD in these hills and you have to come join us in Pittsburgh to mine it.

The other equally amazing working group is focusing on “MEMS Technology Development” and will beta test a set of best practice guidelines for helping you navigate the minefield that is MEMS new product development with a Technology Development Process (TDP) Template. This is going to save you hours and hours of time and gobs of money. Honestly – you want to be with us at M2M so you can be a part of history and check it out.  A preview of the TDP is in their webinar as well.

Beyond this LIFE altering, JOB saving information we will be giving you, you’ll also hear from end-users of MEMS, including a keynote from Len Sheynblat of Qualcomm CDMA Technologies. At M2M I gave Len a soapbox upon which to preach his message about the “importance of MEMS standardization.” I told him he could bitch, complain and suggest what the MEMS industry needs to do to continue to grow and be adopted further into more products or perhaps…to become a trillion dollar industry (like our friend Janusz Bryzek is predicting).

You don’t want to miss all that I have mentioned above, and so much more than I have time to describe here.

The one thing that I am probably most proud of is the fact that this M2M is also getting an inside, never-been-done-before tour of Carnegie Mellon University’s Microsystems’ Lab. We’ll have an overview of the research at Carnegie Mellon’s research labs and then during the poster session, we’ll have the opportunity to see the research up close in areas including microfluidics, tip-based nanofabrication, micro/Nanofabrication, MEMS test, SEM, TEM, X-ray, AFM, micro-CT, Electrical characterization, Neural probes, Soft robotics, Multi-scale manufacturing, Micro/nanorobotics, and AlN MEMS. You do not want to miss this (and not just because I am an alumna).

Last but definitely not least, we’ll close the conference with a fun night out at world famous PNC Park to watch the Pittsburgh Pirates take on the Washington Nationals.  The Pirates aren’t guaranteed to win, but you are guaranteed to have a great time.

I hope I have made my case. Book your flight, get that hotel room and REGISTER NOW. I’ll see you soon at M2M Forum May 8-9 in Pittsburgh!

Carnegie Mellon University Plays Host to MEMS Industry Group with Microsystems’ Lab Tours

Global MEMS companies to see what Carnegie Mellon researchers are doing with ‘miniature machines’

PITTSBURGH, Apr 25, 2012 — MEMS Industry Group (MIG) is bringing the global micro-electromechanical systems (MEMS) supply chain to Pittsburgh for its annual meeting, giving leading MEMS suppliers an opportunity to tour Carnegie Mellon’s microsystems labs on May 8.

Having launched commercial successes such as MEMS microphone- maker Akustica, now owned by the Bosch Group, and BodyMedia, creator of MEMS information systems tracking calories and sleep patterns, CMU’s MEMS labs remain research pioneers for the ‘miniature machines’ that allow consumers to experience electronic devices and the environment in new ways.

“Our members are going to see what’s coming down the pipeline at one of the world’s leading engineering institutions,” said Karen Lightman, managing director of MEMS Industry Group and a CMU alumna. “During their tour of CMU’s MEMS labs, MIG members will have the opportunity to interact with faculty and graduate students to experience the cross-pollination between the commercial business sector and academia, where R&D work often generates new products and technologies for the betterment of society. This is a unique experience, and we are honored and proud to have our members be part of it.”

CMU’s Maarten de Boer, an associate professor in the Mechanical Engineering Department, and Gary Fedder, director of the Institute for Complex Engineered Systems (ICES) and a professor of the Robotics Institute, will host MIG members as they tour a cache of labs involving micro-nanofabrication, micro-nanorobotics, micro-fluidics and other technologies.

“These lab tours and demos are designed to help important industry leaders see some of our leading-edge work involving development of ultra-reliable technologies and to explore new device concepts applicable to many industry sectors from electronics to biomedical engineering,” said De Boer.

Each year, MEMS devices are shipped globally in a variety of consumer products, including mobile phones, tablets, laptops, video games and cameras. They are also embedded in biomedical devices and quality of life applications, automotive safety systems and smart industrial systems. By 2015, industry analysts predict that the MEMS industry will grow to nearly $12 billion.(1) In fact, MEMS products are so ubiquitous that their growth now outpaces growth of other segments of the electronics industry.

“We are experiencing steady and sustained market acceptance in our industry,” said Lightman. “With all of our success, I strongly believe that we have barely scratched the surface of what we can achieve with MEMS. It is through the research and development being conducted at academic institutions like CMU that we will continue to tap the potential of MEMS in the future.”

About Carnegie Mellon University: Carnegie Mellon ( http://www.cmu.edu ) is a private, internationally ranked research university with programs in areas ranging from science, technology and business, to public policy, the humanities and the arts. More than 11,000 students in the university’s seven schools and colleges benefit from a small student-to-faculty ratio and an education characterized by its focus on creating and implementing solutions for real problems, interdisciplinary collaboration and innovation. A global university, Carnegie Mellon’s main campus in the United States is in Pittsburgh, Pa. It has campuses in California’s Silicon Valley and Qatar, and programs in Asia, Australia, Europe and Mexico. The university is in the midst of “Inspire Innovation: The Campaign for Carnegie Mellon University,” which aims to build its endowment, support faculty, students and innovative research, and enhance the physical campus with equipment and facility improvements.

About MEMS Industry Group: MEMS Industry Group (MIG) is the trade association advancing MEMS across global markets. Close to 140 companies and industry partners comprise MIG, including Analog Devices, Applied Materials, Belgian Government, Bluechiip, BodyMedia, Flanders Investment & Trade Office, Robert Bosch Gmbh, Freescale Semiconductor, GE, Hillcrest Labs, Honeywell, HP, Intel, InvenSense, N&K Technology, Nokia, Qualcomm, Silicon Resources, STMicroelectronics, Texas Instruments, VTI Technologies, and WiSpry. For more information, visit http://www.memsindustrygroup.org .

MEMS Industry Group and BSAC form partnership

MEMS Industry Group “MIG”, the leading trade association advancing MEMS across global markets and the  NSF-chartered Berkeley Sensor and Actuator Center* “BSAC”, the premier university-based MEMS fundamental research center, have begun formal collaboration  to bring people and information together to advance knowledge that helps understanding of and mitigation of the barriers that prevent the greater commercial use of MEMS and MEMS-enabled technology.

BSAC will, in fulfillment of this collaboration, become and industry partner of MIG and provide a candidate for the MIG Technical Advisory Board, namely, Professor Albert P. Pisano. The two groups will continue joint educational efforts begun at the Fall 2011 Research Review and 25th anniversary of BSAC. MIG will co-host a workshop at the September 2012 BSAC Thrust sessions in Berkeley September 19, and participate in a joint technical webinar in the fall of 2012.

*BSAC is the NSF Industry/University Research Center on Microsensors & Actuators.

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