IMAPS Device Packaging 2010 Wrap-up

Contributed by Paul Werbaneth, Vice President, Marketing & Applications, Tegal Corporation

Wrap-up, Thursday 11 March 2010

Strolling in Old Town Scottsdale last night after an excellent dinner at Bandera (go early – seems to fill-up quickly after the ballgames let out) I pass the Italian Grotto, a Frank Sinatra-friendly kind of place with good recorded jazz spilling out onto the sidewalk.

So, with apologies to Ol’ Blue Eyes himself, to Paul Anka, to the French songwriting team who originally composed “Comme d’Habitude,” and with a nod to The King, here’s my IMAPS Device Packaging 2010 version of “My Way.”  Sing along if you know the tune!

The MEMS and TSV Way

And now, the end is near;
And so I face the final session.
Phil Garrou, I’ll say it clear,
Heck of a job, of which I’m certain.

A conference, completely full.
I’ve listened oh to many papers;
The take-away? My take-away,
Do it the MEMS and TSV way.

Regards, there are a few;
To James J. Q. Lu, (And Lee Smith too)
From morning dawn to evening blue,
You saw it through, without exception.

You planned each conference track;
Carefully chose among the speakers,
The take-away? My take-away,
Do it the MEMS and TSV way.

Yes, there were times, I’m sure you knew
When I bit off more than I could chew.
But through it all, including lunch,
I ate it up and sat it out.
I heard it all and I stood tall;
I did it the MEMS and TSV way.

I’ve sold, I’ve schmoozed and spied.
I’ve had my fill, of cheese and cocktails.
And now, must catch the tide,
Chase leads and orders, close the sales.

To think we did all that;
And may I say – not in a shy way,
“No, oh no not me,
I did it the MEMS and TSV way.”

For what is a man, what has he got?
If not 3D-IC, then he has naught.
To stack the chips in layers three;
Not side-by-side, so old-school PCB.
The home folks know I worked the show –
Did it the MEMS and TSV way.

Signing off from Scottsdale, AZ.  Thank you all for reading.

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