3D InCites In Brief – December 14

Originally posted on 3D InCites’ Francoise in 3D blog

Dear 3D InCites Members,

Whew – well just as I expected, last week was information overload! I tried to keep up as best as I could. Here are the blog posts that resulted. One overriding theme that came up all the events (IEDM 2011, GSA’s 3D EDA Interest Group and  3-D Architectures for Semiconductor Integration and Packaging) was the importance of communication and collaboration to bring 3D integration to industrialization. This is exactly the sentiment we make an effort to promote here on 3D InCites, and so I have set up an online discussion for those who attended (or wished they’d been able to attend) to express their perspectives and opinions, or to ask questions that should  be addressed.  Although I didn’t recruit a panel this time, I’m hoping to get participation “from the floor.”

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