With all the latest hubbub about FinFets (or as Intel calls them, TriGate transistors) , there seems to be some confusion in terminology, leading to confusion in who’s doing what first. First and foremost, the technology Intel claims to have pioneered is 3D transistors, also known generically as FinFets. TSMC has also announced that they will move forward with FinFets. What people need to understand here, is while TriGate or FinFets ultimately do create three dimensional structures on a chip, the term “3D Chips” refers to stacked die interconnected using through silicon via (TSV) technology. It’s important to understand the difference, because from production processes, design, and market adoption perspectives, these are two completely different animals.
MIG members will be featured at SEMICON West, July 12-14, 2011
MEMS Industry Group (MIG) will present the inaugural display of microelectromechanical systems (MEMS) and MEMS-enabled products entitled “MEMS in the Machine” DemoZone at the Extreme Electronics Stage, South Hall at SEMICON West.
SEMICON West, hosted by SEMI, will take place July 12-14 in San Francisco.
MIG member companies throughout the MEMS supply chain will be featured in the MEMS DemoZone display, showcasing the diversity, enabling capabilities and the nuances of MEMS technology.
Featured products include a consumer product teardown from Chipworks, Amazon – Kindle DX, FitBit, Sertec Sistemas – Low Power tracking device, Gauss Industria – MAP Sensor, and Chumby One based walking Robot from Freescale Semiconductor, a pressure sensor for aircraft flight testing and an accelerometer for automotive safety testing from Meggitt (Endevco), a gas chromatograph from MEMSCAP, a MEMS Thermal IR sensor from OMRON, and a MEMS scanning mirror in a pico-projector from Touch Microsystem Technology (Walsin Lihwa Corporation). Additional products including a MEMS wafer from Okmetic will give examples of MEMS along the supply chain.
A special hands-on demonstration of some of these displays will take place with between on July 12 at 12:45pm after “The Future of MEMS: Solutions for Moving from a Niche to a Mainstream Business” (which takes place at 10:30 am-12:30 pm) during the Extreme Electronics TechXPOT, in the South Hall of SEMICON West. Speakers include Bosch RTC, Teledyne DALSA Semiconductor, GlobalFoundries, imec, Sand9, and Yole Développement discussing how to bring MEMS into the mainstream and stable production no matter what the volume. MIG managing director, Karen Lightman, will moderate the session.