Contributed by St.J. Dixon-Warren and R. Krishnamurthy, Chipworks
Invensense is a leader in the MEMS gyroscope market segment. According to Yole, they experienced nearly 500% growth 2009 over 2008. They now hold the #1 position in the MEMS gyroscope for consumer electronics market.
Chipworks recent had a look inside their new three-axis digital gyroscope, the ITG-3200. The device is built using the Nasiri, single-chip, MEMS process, where the MEMS layer is sandwiched between a fusion-bonded cap wafer and the ASIC. The ASIC and MEMS are bonded using eutectic metal bond. The SEM image in Figure 1 provides a tilt-view of the corner of the MEMS chip, where the MEMS layer can be seen between the cap and ASIC die.