Tag Archives: packaging

IMAPS Device Packaging 2010 Wrap-up

Contributed by Paul Werbaneth, Vice President, Marketing & Applications, Tegal Corporation

Wrap-up, Thursday 11 March 2010

Strolling in Old Town Scottsdale last night after an excellent dinner at Bandera (go early – seems to fill-up quickly after the ballgames let out) I pass the Italian Grotto, a Frank Sinatra-friendly kind of place with good recorded jazz spilling out onto the sidewalk.

So, with apologies to Ol’ Blue Eyes himself, to Paul Anka, to the French songwriting team who originally composed “Comme d’Habitude,” and with a nod to The King, here’s my IMAPS Device Packaging 2010 version of “My Way.”  Sing along if you know the tune! Continue reading

IMAPS Device Packaging 2010, Day 2

Contributed by Paul Werbaneth, Vice President, Marketing & Applications, Tegal Corporation

Day 2, Tuesday 09 March 2010

Cactus league games cancelled by baseball-sized hail

Tuesday, March 09, 2010 Scottsdale, AZ — Spring cactus league games were cancelled in the Valley of the Sun today due to baseball-sized hail.  Indoor activities, including IMAPS Device Packaging 2010, were unaffected. Continue reading

IMAPS Device Packaging 2010

Contributed by Paul Werbaneth, Vice President, Marketing & Applications, Tegal Corporation

Day 1, Monday 08 March 2010, Morning

It’s not supposed to rain in Scottsdale, is it?  Or have I come to the wrong place?

Oh well, when life gives you heavy rain, why not make rainbows? Continue reading

New Best Known Practice Published: MEMS Assembly Process Flow Scenarios

MIG has recently published the second document in its series of Best Known Practices (BKP): MEMS Assembly Process Flow Scenarios authored by Mike Mignardi, Manager, Energy Harvesting, Texas Instruments, and Kevin Chau, Vice President, MEMStaff. The document was reviewed by Tina Lamers, Director of Marketing, Axept, and Alissa Fitzgerald, Managing Member, A.M. Fitzgerald & Associates.

There is no one-size-fits-all approach to ordering the four key process & assembly steps of die singulation, packaging, sacrificial layer removal and testing, Mignardi and Chau write. Instead there are a number of different ways one could successfully order these steps depending on the MEMS device design.

The authors then proceed with a number of alternative scenarios for assembly process flows and insist that these should be carefully considered early on in the MEMS design process, not merely as an afterthought.

MEMS Assembly Process Flow Scenarios is publicly available in its entirety at the Best Known Practices page of the MIG website: www.memsindustrygroup.org/bestknownpractices.

MEMS Industry Group’s Best Known Practices series was started with the intention of fostering best practices while staying away from creating industry standards.  Different approaches and alternative points of view are not only accepted, but are in fact strongly encouraged.

What do you think about this BKP? Does it hit the mark or is it way off? Why not post a comment or even draft your own BKP document? (Authoring a Best Known Practices document is only open to current MIG members.  Those interested should contact info@memsindustrygroup.org.)

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