Tag Archives: Sensors Expo 2010

Sensors Expo 2010 – Day 2

Contributed by Karen Lightman, managing director, MEMS Industry Group

Day two of Sensors Expo 2010 at the Rosemont Convention Center kicked off with a full tour of the expo floor. Attendance was definitely up from 2009 but in humble opinion, the quality and quantity of exhibitors was a bit lower than I expected (considering the foot traffic the show received). There were, of course, a few exceptions – namely MicroStrain (founded by Steve Arms) – a very cool Vermont-based company using sensors (and MEMS) for aerospace, military and other applications.  I’ve been watching MicroStrain for some time and it’s great to see them doing so well.

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Sensors Expo 2010 – Day 1

Contributed by Karen Lightman, managing director, MEMS Industry Group

What a delight it was to be in to Chicago for Sensors Expo 2010 at Rosemont Convention Center. I spent my first day attending the MEMS pre-conference symposium hosted by Roger Grace. The opening keynote for the MEMS symposium was Professor Thomas Gessner from Fraunhofer Research Institute for Electronic Nano Systems (IENS) in Germany. He focused his keynote on the main topic of the day: MEMS integration. In lieu of talking about high volume applications, Professor Gessner spoke of on-chip integration in lower volume for smaller sized customers (their niche). He also touched upon NEMS and a new generation of pressure sensors, as well as nanostructured multi layers using wafer bonding technology. He ended his presentation by discussing the energy harvesting capabilities of IENS’ devices. I will definitely stay tuned. Continue reading

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