Karen’s Blog – Pittsburgh IMAPS Workshop

Packaging means a lot of different things to a lot of different people. Webster’s dictionary defines package as a “group or a number of things, boxed and offered as a unit.”

For my school-age daughters, packaging means figuring out how to maximize the components of their lunch into these bento-box-like containers I bought at Target in hopes that it would simplify their packaging and assembling process (at low cost and decent performance, mind you). Two months into the school year the packaging appears to be weathering extreme temperatures (cold fridge to hot dishwasher), drop-tests (I am sure you need no explanation here) and what I can only describe as a “cram test” (how many Oreos can you fit inside without the box breaking or my parents noticing).

But if you are in the microelectronics/MEMS industry, when you hear the word packaging your mind goes to the various MEMS packages that can contain a multitude of electrical and mechanical components that are inter-connected to the outside world for devices such as MEMS microphones, airbag accelerometers, gyros, RF MEMS and the list just goes on and on.

I had the pleasure to learn more about the challenges and opportunities affecting MEMS packaging at a recent International Microelectronics Assembly and Packaging Society (IMAPS) workshop held in my hometown of Pittsburgh and at my alma mater, Carnegie Mellon University (CMU). Presenters included our host, Gary Fedder, CMU’s Director of the Institute for Complex Engineered Systems (ICES); Maarten de Boer, CMU Associate Professor, Mechanical Engineering; Brett Diamond, MEMS Development Manager, Akustica; Erdinc Tatar, CMU Graduate Student; and yours truly.

To say that my presentation was different from the others is a gross understatement – I talked about the potential for MEMS and sensors in the expanding world of Internet of Things (IoT) as well as an overview of MEMS/sensors standardization and the proactive role that MEMS Industry Group (MIG) and my partners/members/colleagues are playing in addressing the remaining challenges to commercialization. You can access my presentation on the MIG resource library webpage (no password required).

As the others’ presentations are not posted (at least to my knowledge) I figure I’d give you a quick synopsis of what I learned and heard. Gary basically gave an overview about how amazing and fantastic CMU’s engineering, robotics and computer science departments are and that CMU is now partnering and working with universities and centers around the globe. Literally. They even have two programs going on in China.

Maarten’s presentation on the “Effect of Gas Environment and Materials on Electrical Contact Reliability in Micro- and Nanoswitches” was illuminating as I am somewhat familiar with the work that GE Global Research is doing on RF MEMS switches and am aware of the incredible market potential for this area (I wrote a featured blog on this topic for GE’s “Edison’s Desk” earlier this year). Maarten and his colleagues at CMU are taking this a bit further, by looking into different materials and applications at the nano scale.

Brett’s presentation on “Challenges in the Design, Manufacturing, and Usage of MEMS Microphones” was really impressive as it gave a very in-depth view of the true challenges of packaging a device that by design needs to be open to the environment. No small task and it was equally exciting to hear Brett hint at the future applications and integrations with their MEMS mic’s (I will not repeat them here at the risk of disclosing something I shouldn’t). But let’s just say that the market applications for MEMS microphones are just at the beginning – the potential is really big.

Erdinc’s presentation on “Environmental and Packaging Effects on High-Performance Gyroscopes” revealed why so many engineers love their work in the lab – as they are able to tinker and explore with new materials and processes. It’s another reason why I love my work in MEMS/sensors – because there is still an opportunity for “new science.”

MIG helped sponsor the event by providing snacks (including some great chocolate cookie/pie things that melted in my mouth) for the attendees to enjoy while attending the workshop and to facilitate networking. What I learned at the workshop confirmed what I suspected before – packaging is in the eye of the beholder – and at the end of the day what really matters is that the package is at a cost that is reflective of its application and performance expectations.  Therefore, it’s important to communicate those expectations from both the user and supplier’s perspectives.

Packaging means a lot of different things and if done well it can mean the difference between success and failure. Or in my daughters’ case, deciding on how many Oreos to fit into the package before it fails and Mom finds out.

To access Karen’s presentation, click here.

Sensory Shanghai

September 18, 2014/ MEMS INDUSTRY GROUP

Written by: Stephen Whalley, Chief Strategy Officer, MEMS Industry Group

It was over 10 years ago that I last visited Shanghai and oh my, how things have changed, most visibly, the skyline.  Looking across the Huangpu River from The Bund back then, I clearly remember the ‘Pearl’ TV tower and a few tall buildings and thought how impressive it looked.  Now, the view is an even more sumptuous feast for the eyes, day or night, and it keeps on growing and evolving.  So too does the connectivity of the buildings and the people that live and work in Shanghai as the Internet of ‘Things’ brings it all together locally and globally.

Shanghai circa 2001

Shanghai city photo 1

Shanghai 2014

Shanghai city photo 2

I was in Shanghai to co-host the inaugural MEMS Industry Group (MIG) Conference Shanghai, September 11-12th, with our local partners, the Shanghai Industrial Technology Research Institute (SITRI) and the Shanghai Institute of Microsystem and Information Technology (SIMIT).  The theme was the Internet of Things and how the MEMS and Sensors supply chain needs to evolve to address the explosive growth in China.

As one of our featured speakers, Jérémie Bouchaud of IHS pointed out, China-based smartphone vendors such as Lenovo, Huawei, ZTE, Xiaomi Technology and Oppo collectively make China the third largest handset manufacturer globally behind Apple and Samsung.  With each handset having a dozen or more MEMS and sensor components, it’s easy to see why China’s government, research organizations, OEMs and investment funds are paying attention to this market.  They also see where it’s going beyond these mobile consumer electronic devices of today.  With the rise of smart cities, buildings, farms, homes, vehicles, wearable devices and more — where clusters of sensors abound — the hockey-stick growth predictions are gathering momentum.

With that background, over 150 attendees from China and 15 other countries came together to hear and discuss what’s needed to meet this opportunity.  New technologies and products, fabs, funding and city infrastructure were all covered throughout the conference.  It was clear that the international MEMS/sensors suppliers do not want to blink and miss the opportunity (as some already have, and to their detriment) and that the local MEMS/sensors community wants to ensure they do all they can to build a self-sustaining supply chain in and around Shanghai.  MEMS Industry Group members can access all the great presentations here.

For the time being, the potential and high stakes for all sides means that the Shanghai skyline will be a familiar sight for locals and visitors to cast their eyes, and ‘inter-nets,’ over.  And just as the skyline has grown dramatically, it appears the MEMS and sensors industry in China is on the rise too.

To view photos of the inaugural event, visit our Flickr page!

 

Industry Survey: The Southwest Center for Microsystems Education

Submitted by The Southwest Center for Microsystems Education

The Southwest Center for Microsystems Education, a National Science Foundation Advanced Technological Education Center, is working on a project to better understand the current state of the micro and nanotechnology based industry technician workforce. Through this project, we aim to enable our center to best support Community Colleges’ efforts to start micro and nano technology programs that use SCME developed curricula.

One goal of this project will be a map of the related, hi-tech industries relative to their local Community Colleges.  We can then identify which regions our programs will make the greatest impact.  This allows us to advocate and support the adoption of micro and nano education by Community Colleges on behalf of their regional micro and nano and related industries.

Click here to view the last revision of the map and hiring data through 2012.

Our second goal will be a trend analysis of several mapped industries.  The SCME has divided the micro-nano related industries into several categories based on specialty and industry revenue.  We aim to identify at least ten companies in each bracket and to determine their workforce needs so that we can target our educational impact efforts to yield the best results for both industry and education!  These trends are presented to the Community Colleges near micro and nano tech related clusters, to provide a justification for incorporating microsystems based curricula into their programs.  This enables the SCME to distribute scarce educational resources into the educational institutions where their impact will be the highest, resulting in a more informed and capable workforce.

This is where we need your help!   As leaders in MEMS and related industries, please completing the survey found by clicking the following link:

https://www.surveymonkey.com/s/RK6TG55

Aggregate findings will be shared with you as well as information pertaining to educational resources that will assist you as you build your technician workforce pipeline and enable you to be in a better position to plan workforce growth.  Please consider collaborating with SCME to support our shared industrial workforce educational improvement goals!

 

Previous MIG Blog:

http://memsblog.wordpress.com/2011/09/16/survey-the-southwest-center-for-microsystems-education/

SEMICON West Wrap-Up

Chivonne & Monica say, "Thanks for a great time at SEMICON West!"

Chivonne & Monica say, “Thanks for a great time at SEMICON West!”

Two weeks ago, MIG had a wonderful time at SEMICON West, participating in a variety of constructive and gratifying industry-focused networking opportunities.  The Jam-packed event saw both MIG and its members engage in everything from demonstrations to cocktail receptions.

Over 30 member companies exhibited on the show floor, showing off their latest in equipment, materials, packaging solutions, design automation tools, foundry services, product development and R&D, while still more members busied themselves with private appointments off of the show floor.

MIG welcomed increased traffic at our booth, showing just how relevant MEMS has become, while reinforcing why an industry association is the key to connecting to partners to increase business opportunities. The MIG team enthusiastically spoke about the benefits of joining MEMS Industry Group while promoting our members to interested individuals.

SEMI hosted their traditional MEMS content entitled, “Next Generation MEMS”, on Tuesday, July 8th.  This content featured all MIG member and partner companies, including Yole Développement, Qulacomm, Silex Microsystems, GE Global Research, Si-Ware, SolMateS, NIST and EV Group. Shared content emphasized new challenges and opportunities for the MEMS supply chain to meet the needs of the expanding range of mobile devices, wearables and smart objects in the Internet of Things.

MIG also hosted its increasingly-popular cocktail party at Restaurant Lulu on Wednesday night, July 9th.  With over 300 people in attendance, it was THE place to be for MIG members to meet and network.

MIG would like to thank our Platinum Sponsor Plan Optik and Bronze Sponsors C2MI, Expertech and Oxford Instruments for making SEMICON West and the cocktail party possible. If you want to relive the memories or are curious about what you missed, be sure to check out photos from the event.

What’s Driving Wearables? MIG’s Karen Lightman Discusses in INNO Magazine

Untitled

MIG’s very own Karen Lightman recently graced the front page of IVAM Microtechnology Network‘s INNO magazine with her thorough discussion of MEMS and wearables.  In the piece, Karen talks about the US’ disposition to focus on wearables technology, while other areas of the world spend their time and resources elsewhere, and how we’re backing these efforts with crowdfunding support.  To read Karen’s thoughts on this explosive industry, head to ivam.de and download the pdf!

Sensor Fusion in a State of Flux as Companies Fuse Together

Guest post by Tony Massimini, Semico Research

There has been a great deal of activity among companies within the sensor fusion ecosystem. Mergers and acquisitions are changing the competitive landscape.

As a quick background, sensor fusion is the technology of combining data from multiple sensors and deriving intelligence from that data.  It is the foundation for motion tracking, navigation, context awareness, location based services, augmented reality and more.  It is the basis for future innovative applications.  The brains behind sensor fusion is in the algorithms.  This is usually embedded in a 32-bit microcontroller core or similarly powerful processing device, known as a sensor hub.

In May 2014, Fairchild announced the acquisition of Xsens the Dutch company known for motion tracking software.  Xsens has been doing motion tracking for film and other such applications.  It has modules with low cost consumer grade inertial motion MEMS sensors from STMicroelectronics.  At the time of the acquisition, Fairchild also announced that it would be bringing MEMS sensors to market soon as well.

In the last couple of weeks there has been a flurry of activity amongst the sensor fusion ecosystem players.  On June 24, 2014 Audience announced it would acquire Sensor Platforms.  The buyout is expected to be complete by mid-July 2014.  On July 7, 2014 InvenSense announced it was acquiring two companies, Movea and Trusted Positioning, Inc.  These acquisitions are to be finalized by the end of September 2014.

Audience is a relatively small company with about $150 million in annual sales.  It has been known mainly for voice and sound processing.  It was designed into the Apple iPhone 4S but did not maintain its design win in Apple’s next generation iPhone.  Sensor Platforms is a third-party sensor fusion algorithm developer.  The company has been focused on context awareness and indoor navigation.  Sensor Platforms licenses its algorithm to OEMs and to sensor hub chip vendors.  Audience had been working with Sensor Platforms for its always-on sensor fusion for voice and motion and decided to acquire the company for $41 million.  The name of Sensor Platforms will no longer be used following completion of the acquisition.

Audience also has a motion processor, MQ100, which will launch late 2014.  This is a DSP based device which will function as a sensor hub controller.  The sensor fusion algorithm developed with Sensor Platforms will be embedded in MQ100.

InvenSense has been a fast growing company delivering inertial motion sensors (gyroscope, accelerometer magnetometer) in multi-chip packages with its digital motion processor.  The company has been focused on motion tracking and pedestrian navigation for mobile devices and wearables.  At the end of 2013 it acquired the microphone business of Analog Devices.  Movea, like Sensor Platforms, is a sensor fusion algorithm developer which licenses the algorithm to OEMs and sensor hub controller vendors.  Movea provides of software for ultra-low power location, activity tracking and context sensing.  Its IP is found in consumer mobile (smartphones and tablets), TV interaction and wearable sports & fitness applications.  Movea’s context analysis uses both motion and audio sensors.

Trusted Positioning Inc. (TPI) is a software company providing indoor/outdoor positioning solution for mobile and wearable devices.  This has been a key area of development for InvenSense.  TPI’s platform also provides inertial navigation software solutions for in-vehicle navigation, personnel tracking, and machine guidance and control.

Semico Spin

Semico has stated several times that the value for Sensor Fusion is in the algorithm.  The average selling prices for the sensors are falling rapidly.  The hardware is becoming more of a commodity.

These acquisitions show that the chip vendors want to add value to their products.

Sensor fusion is expanding to include more data sources.  Sound for always-on context awareness and to provide spatial awareness is the next step.  Therefore, the microphones are key elements.  More sensors for biological and environmental data will come into use.  InvenSense, Audience and Fairchild want to integrate more IP in their respective technologies.

Sensor fusion is moving beyond smartphones and tablets into wearables and other products.  At a MEMS Industry Group panel at the Consumer Electronics Show in Las Vegas, Jan. 2014, Semico stated that wearables with 9-axis or more and sensor fusion features would be a high growth market.  It was at CES 2014 that InvenSense and Movea in separate announcements revealed they had reference platforms for wearables with 9+ axis sensor fusion.  Clearly both companies were on the same page at that time.

Impact on the Market

Less than a year ago, there were four companies licensing sensor fusion algorithms: PNI Sensor, Sensor Platforms, Movea and Hillcrest Labs.

In June 2013 PNI announced an ASIC, Sentral, which embeds its algorithm.  It still licenses its algorithm but on a selective and strategic basis.

Following these recent acquisitions, it is assumed that licensing commitments involving Sensor Platforms and Movea will be honored.  It seems to Semico that it is unlikely future licenses will be extended.  Both InvenSense and Audience will have sensor hub controllers in competition with other companies.  Thus, the only remaining independent third party sensor fusion developer without a competing chip is Hillcrest Labs.

Hillcrest Labs has a wide customer base.  In March 2014, it was announced that Hillcrest Labs and Bosch Sensortec were collaborating on a sensor hub solution for head mounted displays and wearable devices.  Following the recent announcements concerning their competitors, Hellcrest Labs has seen an uptick in interest for their products.

OEMS want options and do not want to be locked into one supplier.  Semico believes that one option sensor hub vendors and OEMs will pursue is to develop their own in-house sensor fusion algorithms.  However, this expertise is in short supply.  This is a specialized area of study.  Even with a strong team it could take one to two years to get up to speed.

The market for sensor fusion and sensor hub controllers is growing rapidly.  Smartphones are currently the largest market, but the technology is being leveraged into other areas, especially wearable devices for sport, health, fitness and medical.

Semico forecasts that the market for sensor hub controllers will reach 2.5 billion units by 2018, CAGR (’13 to ’18) 27.4%.  The wearable market will see CAGR of 114% reaching over 300 million units for devices with 9-axes or more.

MEMS revenues due to sensor fusion will grow to $7.7 billion by 2018 CAGR (’13 to ’18) of 20.3%.  In 2013 MEMS revenues in sensor fusion applications account for 23.6% of the total MEMS market.  By 2018, this will grow to 34% of the MEMS market.

For more detailed information on the sensor fusion market and the companies mentioned in this blog, please contact Rick Volgelei at rickv@semico.com.